Metallographic polishing solution

1、 Product series and technical characteristics

1. Single crystal diamond suspension polishing solution

• solvent typeSupport customization of water-based, oil-based, lubricating based, and alcohol based materials to meet the anti-corrosion needs of different materials1.

• Particle size range：

• Conventional particle size: 1 μ m, 3 μ m, 6 μ m, 9 μ m (coarse to medium).

• Precision particle size0.25 μ m, 0.5 μ m (nanometer level precision polishing, customizable).

• Packing Specification250ml, 500ml, 1L transparent bottles for easy dosage control.

2. Diamond polishing spray

• Morphological characteristics: spray design, the diamond powder is evenly suspended in the solvent, and the spraying coverage is more uniform.

• Granularity coverageW0.1 to W40 (ultra fine W0.1 to coarse grinding W40 for culvert cover).

• Packaging capacity260g/bottle, 350ml/bottle, suitable for manual or semi-automatic equipment.

3. Polishing paste and micro powder(Supporting products)

• polishing pasteThe paste like carrier contains self-lubricating components and is suitable for manual precision polishing of soft materials such as aluminum and copper alloys.

• micronized powderProvide users with the ability to independently allocate carriers, with high flexibility.

2、 Core performance advantages

1. Efficient Grinding and Energy Saving

• Polishing efficiency improvementCompared to traditional alumina polishing solution, the usage is reduced by 30% and the time is shortened by 60%.

• Suspension stabilityUsing physical chemical double action suspension technology, particles are uniformly dispersed and stored for a long time without precipitation.

2. Surface quality optimization

• Low damage polishingSingle crystal diamond has sharp cutting edges, reduces subsurface damage, and truly restores the microstructure of materials (such as hard alloy grain boundaries and semiconductor wafer defects).

• Wide adaptabilityCompatible with various types of polishing cloths (non-woven FP-PLAN, plush FP-FLOC) and automatic/manual equipment.

3. Environmental protection and operational convenience

• Water based formula is non-toxic and environmentally friendly, while oil-based is suitable for waterproof materials such as PCB.

• The spraying agent supports the "centrifugal radius spraying method", which completes spraying in 3-5 seconds, simplifying the process.

3、 Application scenarios and selection suggestions

noteFor precision polishing, it is recommended to use FEMA polishing lubricant (such as Lubricant Green series) to enhance cooling and anti adhesion effects.

4、 Usage guide and precautions

1. preprocessingThe polishing cloth should be soaked in clean water to avoid dry friction and temperature rise, which may cause oxidation of the sample.

2. Spray coating specifications：

• After the spray agent is shaken evenly, it is sprayed along the radius 20cm away from the polishing disc, and the new cloth is extended to 8 seconds to enhance adsorption.

• It is recommended to add the suspension dropwise and cooperate with the automatic distribution system of the equipment (such as Fpol 252C Pro grinding and polishing machine).

3. Cooling assistanceContinuously drip water or specialized coolant during polishing to suppress thermal effects.

summary

The diamond polishing liquid system of Fermat instrumentMulti form adaptation(suspension/spray/paste)Nano level precision coverageandScenario based formulaAs a core competitive advantage, especially in the fields of high hardness material polishing and microelectronic sample preparation, it has significant advantages. Its technological highlights lie in:

• Customization flexibilitySupport on-demand customization of particle size and solvents;

• Process efficiency improvementShorten the sample preparation cycle through suspension stability and high grinding rate;

• Ecological compatibilityEnvironmentally friendly formula reduces the risk of laboratory contamination.
  This product line can meet the full scenario requirements from industrial testing (metallographic analysis of automotive parts) to cutting-edge scientific research (semiconductor failure analysis).