Lithography process equipment

NegotiableUpdate on 02/09

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

Overview of Lithography Process Equipment Products: $n Applied to 3D Packaging LED、 Main configurations in the fields of microelectromechanical systems, compound semiconductors, power devices, etc.: automatic alignment, automatic exposure, LED light source, machine vision alignment system, high-precision silicon wafer carrier, automatic wedge error compensation system. LED light source: 3 wavelength arbitrary configuration, supporting more application scenarios. High resolution and high uniformity; Long service life and easy maintenance: $n machine vision alignment system: top and bottom dual-mode alignment, large field of view, high precision; Four types of lighting options are available, with strong process adaptability; Free switching between manual and automatic modes

Product Details

Lithography process equipmentProduct Overview:

Applied to 3D packaging LED、 In the fields of microelectromechanical systems, compound semiconductors, power devices, etc.

Main configuration: automatic alignment, automatic exposure, LED light source, machine vision alignment system, high-precision silicon wafer carrier, automatic wedge error compensation system.

LED light source: 3 wavelengths can be configured arbitrarily, supporting more application scenarios.

High resolution and high uniformity; Long service life and easy maintenance:

Machine vision alignment system: dual-mode alignment at the top and bottom, with a large field of view and high precision; Four types of lighting options are available, with strong process adaptability; Free switching between manual and automatic modes.

Lithography process equipmentTechnical Specifications:

Mask template, silicon wafer
Silicon wafer size	8'/ 6'
wafer thickness	max.10 mm
Mask template size	9' ×9'/ 7' ×7' (SEMI)
Mask thickness	max.6.35 mm
exposure mode
contact method	Soft contact, hard contact, vacuum contact
Exposure gap	0~1000 μm
Gap accuracy	1 μm
Exposure intensity	0 ~ ≥40mw/cm 2
Exposure lens
Light source type	LED
Exposure wavelength	365nm，405nm，
Uniformity of light intensity	≤4% 8' / ≤3% 6'
resolution	Vacuum contact ≤ 1um
	Hard contact ≤ 1.5 μ m
	Soft contact ≤ 2.2 μ m
	Gap ≤ 3.6 μ m
Alignment mode
Top alignment	< ±1 μm
Optional bottom alignment	< ±2 μm
Top alignment focusing range	5 mm
Bottom alignment focusing range	5 mm
Silicon wafer carrier platform
range of motion	X ：± 5 mmy ：± 5 mm θ: ± 5 °
resolution	0.04 μm
Top aligned lens
Mobile range	6' 40~150mm
	8' 40~200 mm
Align the bottom with the lens
Mobile range	6' 40~150mm
	8' 40~200 mm
User interface
Windows 10	Storable process menu
Venue service requirements
Vacuum<-0.8 kPa; Nitrogen>0.5 Mpa; Compressed air: 0.6~0.8 Mpa
Power supply demand
Voltage: 230 V ± 10%	Frequency: 50-60 Hz
Size and weight
Length x Width x: 1200 x 1000 mm	Height: 1973 mm Weight:~400 kg