HL-GL-W20 Green Laser Cutting Machine

NegotiableUpdate on 02/15

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

Product Introduction GL-20 is designed by Hailei Laser Technology Co., Ltd. based on the absorption of advanced laser technology from Europe and America, with the assistance of professional design through company processes. The use of stress-induced laser cutting technology can not only cut ceramics, silicon wafers, wafers, glass, etc., but also has good effects on PCB board cutting. Multi functionality and versatility are another support point for the company to seek technological breakthroughs in the development of new products for customers. The use of auxiliary laser technology effectively prevents microcracks during laser processing, greatly improving the cutting efficiency of the equipment. The cutting speed of 1mm zirconia ceramics is 1mm/s, efficiently processing various fragile ceramic materials, glass materials, and silicon materials

Product Details

Product Introduction

GL-20 is designed by Hailei Laser Technology Co., Ltd. based on the absorption of advanced laser technology from Europe and America, with the assistance of the company's process and professional design. The use of stress-induced laser cutting technology can not only cut ceramics, silicon wafers, wafers, glass, etc., but also has good effects on PCB board cutting. Multi functionality and versatility are another support point for the company to seek technological breakthroughs in the development of new products for customers. The use of auxiliary laser technology effectively prevents microcracks during laser processing, greatly improving the cutting efficiency of the equipment. The cutting speed of 1mm zirconia ceramics is 1mm/s, efficiently processing various fragile ceramic materials, glass materials, silicon materials, PCB, PDC, etc.

application area

Mainly used for cutting special ceramics, glass, crystal products, such as fuel cells, mobile phone screens, LCD screens, optical devices, automotive glass, etc. It can be applied to the surface processing of the vast majority of metal and non-metal materials, as well as the processing of coating films. Such as electronic devices, TFTs, etc.

performance parameter

Technical Parameter	specifications
Maximum worktable size	*X-axis 300mm Y-axis 300mm (according to customer selection)**
Cutting range Y-axis	*Y-axis 300mm X-axis 300mm (according to customer selection)**
Focus diameter	15-30μm
Minimum line width	0.05mm
X. Y-axis positioning accuracy	±100μm
X. Y-axis repeatability accuracy	±30μm
wavelength	532nm
Laser repetition frequency	10HZ-200HZ
Thermal stress-induced laser system	a set
Power demand	220V/50HZ/30A
Whole machine power consumption	2.5KW
host system	1600X1200X1600
Cooling system	350X350X400
300X300 servo stepper motor platform system	a set
Device Software	Self made professional green laser cutting software

This device will apply for a national patent, and some detailed information cannot be provided temporarily. Please kindly keep the customer's technology confidential.