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Phone
15986646062
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Address
4th Floor, Building 2, Zhengke Times, No. 17 Dawangshan Industrial Road, Shajing, Bao'an District, Shenzhen
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Shenzhen Hailei Laser Technology Co., Ltd
HL-C-W400 laser cutting machine
NegotiableUpdate on 02/15
- Model
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Overview
Product Introduction: HL-C400 Laser Cutting Machine is an automated equipment designed using laser technology and numerical control technology. It has the characteristics of high efficiency, low cost, safety, and stability. Mainly used for high-precision cutting and punching of metal sheets. This model can be designed as both closed and open for users' needs. The HL-C400 laser cutting machine is mainly used for non-contact cutting and punching of metal plates and pipes below 4mm, with a minimum cutting seam of 0.15mm. It is particularly suitable for cutting and punching materials such as stainless steel plates, iron plates, silicon wafers, ceramic sheets, etc. It is widely used in the precision electronics, decoration, mold, handheld digital, sheet metal, and hardware industries. The HL-C400 laser cutting machine uses high-energy pulse lasers to cut objects. Pulse discharge of xenon lamp through laser power supply, forming
Product Details
Product Introduction
The HL-C400 laser cutting machine is an automated equipment designed using laser technology and numerical control technology, which has the characteristics of high efficiency, low cost, safety, and stability. Mainly used for high-precision cutting and punching of metal sheets. This model can be designed as both closed and open for users' needs.
The HL-C400 laser cutting machine is mainly used for non-contact cutting and punching of metal plates and pipes below 4mm, with a minimum cutting seam of 0.15mm. It is particularly suitable for cutting and punching materials such as stainless steel plates, iron plates, silicon wafers, ceramic sheets, etc. It is widely used in the precision electronics, decoration, mold, handheld digital, sheet metal, and hardware industries.
The HL-C400 laser cutting machine uses high-energy pulse lasers to cut objects. By using a laser power supply to discharge xenon lamp pulses, a light wave with a certain frequency and pulse width is formed and radiated into Nd3+: YAG crystal through a focusing cavity. The crystal emits 1064nm pulsed laser after resonance, which is then expanded, reflected, and focused on the workpiece to achieve local melting, gasification, and cutting. The equipment is equipped with an industrial PC controlled high-precision CNC worktable, which performs high-precision cutting and drilling by adjusting the laser frequency, pulse width, worktable speed, and movement direction during cutting.
application area
The HL-C400 laser cutting machine is mainly used for non-contact cutting and punching of metal plates and pipes below 4mm, with a minimum cutting seam of 0.15mm. It is particularly suitable for cutting and punching materials such as stainless steel plates, iron plates, silicon wafers, ceramic sheets, etc. It is widely used in the precision electronics, decoration, mold, handheld digital, sheet metal, and hardware industries.
The HL-C400 laser cutting machine uses high-energy pulse lasers to cut objects. By using a laser power supply to discharge xenon lamp pulses, a light wave with a certain frequency and pulse width is formed and radiated into Nd3+: YAG crystal through a focusing cavity. The crystal emits 1064nm pulsed laser after resonance, which is then expanded, reflected, and focused on the workpiece to achieve local melting, gasification, and cutting. The equipment is equipped with an industrial PC controlled high-precision CNC worktable, which performs high-precision cutting and drilling by adjusting the laser frequency, pulse width, worktable speed, and movement direction during cutting.
application area
1. Cutting precision laser cutting of stainless steel plates, iron plates, alloy plates, etc. below 4mm, such as mobile phone accessories, PCB boards, stainless steel mesh for silk screen printing, and other metal thin plates
2. Cutting cut flowers such as steel pipes below 3mm, such as laser cutting for new stainless steel rings.
3. Laser drilling of metal plates, such as water filter cartridges for hydropower stations and metal filter screens.
4. Laser cutting of silicon wafers and ceramic wafers.
performance parameter
Sample Display
2. Cutting cut flowers such as steel pipes below 3mm, such as laser cutting for new stainless steel rings.
3. Laser drilling of metal plates, such as water filter cartridges for hydropower stations and metal filter screens.
4. Laser cutting of silicon wafers and ceramic wafers.
performance parameter
Sample Display
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