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Shanghai Mifang Electronic Technology Co., Ltd
FE1000 packaging equipment
NegotiableUpdate on 05/06
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Overview
In order to maintain its flexible characteristics, flexible electronic devices usually use thin film deposition processes to prepare different functional layers on flexible and stretchable substrate materials to construct flexible electronic devices. With the continuous expansion of the application scope of flexible electronics, higher requirements have been put forward for the performance and lifespan of devices, and the packaging of flexible electronic devices has become increasingly important. Encapsulation not only protects flexible electronic devices from physical damage such as external scratching and impact, but also prevents corrosion and failure of functional layers caused by surrounding environments such as water, oxygen, particles, and temperature, thereby ensuring device performance and extending service life.
Product Details
In order to maintain its flexible characteristics, flexible electronic devices usually use thin film deposition processes to prepare different functional layers on flexible and stretchable substrate materials to construct flexible electronic devices. With the continuous expansion of the application scope of flexible electronics, higher requirements have been put forward for the performance and lifespan of devices, and the packaging of flexible electronic devices has become increasingly important. Encapsulation not only protects flexible electronic devices from physical damage such as external scratching and impact, but also prevents corrosion and failure of functional layers caused by surrounding environments such as water, oxygen, particles, and temperature, thereby ensuring device performance and extending service life.
Specially designed for the packaging requirements of flexible electronic devices
Integrated adhesive packaging, coating packaging, and vacuum hot pressing packaging three packaging processes
Support hot press packaging under inert gas atmosphere
Support the design of packaging processes and the setting and adjustment of various parameters to ensure process consistency
Suitable for various common adhesive film materials and packaging adhesives
Suitable for electronic devices with various thicknesses of soft/hard substrates
Suitable for organic/perovskite solar cells, electroluminescent/color changing devices, flexible circuits, photoelectric sensors, supercapacitors, hybrid circuits, and other devices
Application Cases
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