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E-mail
wu.xiaoyu@ym-qbt.com
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Phone
19906051395
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Address
Anren Industrial Park, 1068-6 Jimei North Avenue, Jimei District, Xiamen City
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Xiamen Yunmao Technology Co., Ltd
Dual cavity high vacuum plasma atomic layer deposition system
NegotiableUpdate on 01/29
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Overview
The dual chamber high vacuum plasma atomic layer deposition system is a technique that forms a deposition film by alternately introducing gas-phase precursor pulses into the reaction chamber and chemically adsorbing and reacting on the deposition substrate. It has self limitation and self saturation. The main application of atomic layer deposition technology is to deposit high-precision, pinhole free, and highly conformal nanofilms on substrates of various sizes and shapes.
Product Details
1、 Core parameters:
Origin category:Domestic Atomic Layer Deposition System (ALD)
Substrate size: 6 inches
Process temperature: RT-300 ℃
Precursor number: up to 3 groups of plasma reaction gases and 8 groups of liquid or solid reaction precursors can be included
Weight: 300KG
Size (WxHxD): 1400 * 1000 * 1900mm
Uniformity: 99%
IIAtomic layer depositionIt is a technique that forms a deposition film by alternately introducing gas-phase precursor pulses into the reaction chamber and chemically adsorbing and reacting on the deposition substrate, with self limitation and self saturation. The main application of atomic layer deposition technology is to deposit high-precision, pinhole free, and highly conformal nanofilms on substrates of various sizes and shapes.
3、 Product Description:
The double chamber high vacuum plasma atomic layer deposition system (QBT-T) of Xiamen Yunmao Technology Company adopts a double chamber design, and independent control can be achieved between chambers, resulting in double output. The chambers are PEALD chamber and powder ALD chamber. Due to the dual chamber and dual function design, the equipment can achieve plasma ALD growth process and powder ALD coating process on a flat surface. The equipment is equipped with an independently controlled 300 ℃ complete heating reaction chamber system to ensure uniform process temperature. The system has design options such as powder sample tank, wafer carrier, fully automatic temperature control, ALD precursor source steel cylinder, automatic temperature control valve, industrial grade safety control, as well as on-site RGA, QCM, ozone generator, glove box, and polarizer rack. It is one of the best research and development tools for energy materials, catalyst materials, new nanomaterials, and semiconductor research and application.
4、 Xiamen Yunmao Technology Co., Ltd. provides you with information on the parameters, prices, models, and principles of the QBT-T dual chamber high vacuum plasma atomic layer deposition system. The QBT-T is produced in Fujian, branded Yunmao, and has a model number of QBT-T. The price ranges from 1 million to 2 million RMB. For more related information, please consult our customer service hotline 24/7.
5、 Technical parameters:
Origin category:Domestic Atomic Layer Deposition System (ALD)
Substrate size: 6 inches
Process temperature: RT-300 ℃
Precursor number: up to 3 groups of plasma reaction gases and 8 groups of liquid or solid reaction precursors can be included
Weight: 300KG
Size (WxHxD): 1400 * 1000 * 1900mm
Uniformity: 99%
IIAtomic layer depositionIt is a technique that forms a deposition film by alternately introducing gas-phase precursor pulses into the reaction chamber and chemically adsorbing and reacting on the deposition substrate, with self limitation and self saturation. The main application of atomic layer deposition technology is to deposit high-precision, pinhole free, and highly conformal nanofilms on substrates of various sizes and shapes.
3、 Product Description:
The double chamber high vacuum plasma atomic layer deposition system (QBT-T) of Xiamen Yunmao Technology Company adopts a double chamber design, and independent control can be achieved between chambers, resulting in double output. The chambers are PEALD chamber and powder ALD chamber. Due to the dual chamber and dual function design, the equipment can achieve plasma ALD growth process and powder ALD coating process on a flat surface. The equipment is equipped with an independently controlled 300 ℃ complete heating reaction chamber system to ensure uniform process temperature. The system has design options such as powder sample tank, wafer carrier, fully automatic temperature control, ALD precursor source steel cylinder, automatic temperature control valve, industrial grade safety control, as well as on-site RGA, QCM, ozone generator, glove box, and polarizer rack. It is one of the best research and development tools for energy materials, catalyst materials, new nanomaterials, and semiconductor research and application.
4、 Xiamen Yunmao Technology Co., Ltd. provides you with information on the parameters, prices, models, and principles of the QBT-T dual chamber high vacuum plasma atomic layer deposition system. The QBT-T is produced in Fujian, branded Yunmao, and has a model number of QBT-T. The price ranges from 1 million to 2 million RMB. For more related information, please consult our customer service hotline 24/7.
5、 Technical parameters:
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