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DZX6601 lithium battery sealing adhesive

NegotiableUpdate on 05/06
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Overview

DZX6601 lithium battery potting adhesive is an ideal choice for protecting sensitive electronic components in the environment. Organic silicon potting adhesive can withstand temperatures ranging from -115 ℃ to 300 ℃, has anti vibration properties, and is also resistant to moisture and atmospheric pollutants. Xinwei silicone products include two curing systems, tin and platinum, which have various hardness and curing speeds. We have thermal conductive materials and flame-retardant silicone adhesives that meet UL94V-0 requirements.

Product Details

  DZX6601 lithium battery sealing adhesive
It is a low viscosity two-component addition molding silicone sealant that can cure at room temperature or heat, with the characteristic of faster curing at higher temperatures. During the curing process, no 0.83 centimeters are produced, which can be applied to the surfaces of materials such as PC (Poly carbonate), PP, ABS, PVC, and metals.
  Key Features:
Wide temperature resistance range: -50 ℃~200 ℃
Compliant with the environmental regulations of Rohs and RECH in the European Union
Flame retardant rating meets UL94V-0 [E351581]
  Application industry:
Lighting fixtures, new energy, military electronics, electrical and electrical engineering
  Application products:
Resistors, buried lights, Baomi lights, power adapters, inverters, solar junction boxes, transformers
Product Features
DZX6601 lithium battery potting adhesive is an ideal choice for protecting sensitive electronic components in the environment. Organic silicon potting adhesive can withstand temperatures ranging from -115 ℃ to 300 ℃, has anti vibration properties, and is also resistant to moisture and atmospheric pollutants. Xinwei silicone products include two curing systems, tin and platinum, which have various hardness and curing speeds. We have thermal conductive materials and flame-retardant silicone adhesives that meet UL94V-0 requirements.
  Process Used
1. Before mixing, mix component A and component B thoroughly in their respective containers.
2. When mixing, a weight ratio of 1:1 between component A and component B should be followed.
3. Generally speaking, molds below 20mm can naturally defoam after molding, as high temperatures can accelerate curing speed or mold depth is deeper, so defoaming can be performed as needed. At this time, in order to remove the bubbles generated on the surface and inside after molding, the mixed solution should be placed in a vacuum container and defoamed for at least 5 minutes at 0.08MPa.
4. The corresponding curing time should be maintained above the temperature given in the technical parameter table before and after curing. If the application thickness is thick, the curing time may exceed. It can be cured at room temperature or by heating. The curing speed of glue is affected by the curing temperature, and it takes a long time to cure in winter. It is recommended to use heating method for curing, curing at 80-100 ℃ for 15 minutes, and curing at room temperature generally takes about 8 hours.