Crystalbond 509/555/590 low melting point assembly adhesive

Crystalbond 509/555/590 low melting point assembly adhesiveIt is a low melting point high-strength adhesive that is an ideal choice for temporary bonding of products that require cutting, polishing, and other processing procedures. They exhibit high adhesive strength and can easily adhere to metals, glass, and ceramics by heating and melting. After processing, the adhesive can be removed by reheating and using environmentally friendly cleaning agents.

Crystalbond ™ 509 provides excellent adhesion and minimizes clogging of cutting tools. They are transparent in thin sections. Dissolved in acetone, odorless, non flammable, and biodegradable. Insoluble in water, can be washed with water.

Crystalbond™ 555 & 555-HMP

A low melting point adhesive used in medium stress processing. It is transparent on a thin cross-section and soluble in hot water. The melting point of 555 is 54 º C; 555-HMP is 66 º C.

Crystalbond™ 590

A high-strength and elastic adhesive system is an ideal choice for making micro and long samples. It is soluble in methanol or isopropanol

Typical Applications

Processing advanced ceramics

Grinding and polishing optical components

Cutting ceramic substrates and semiconductor wafers

Cutting ferrite, glass, and piezoelectric materials

Cutting metal and optical single crystals

Assemble cross-sectional samples for electron microscopes

Temporary loading of mechanical components