Copper ion online titration analyzer for acid copper plating solution

Copper ion online titration analyzer for acid copper plating solution

(Iodometric electrode titration type)

1 Overview

Copper ion online titration analyzer for acid copper plating solutionIt is specifically designed forelectroplating production lineThe designed real-time monitoring device is suitable forPCBAcid copper plating solution tank (such as copper sulfate plating solution) for electroplating, hardware electroplating, decorative copper plating and other scenarios. This device has passed throughFully automatic electrode titration technologyReplace traditional manual sampling laboratory analysis to solve problems such as uneven coating thickness, pitting, and roughness caused by fluctuations in copper ion concentration in the plating solution.

In continuous production, the stability of the plating solution composition directly determines the product qualification rate, while manual testing has limitations2-4Hourly lagCan easily lead to batch quality accidents. This device will shorten the analysis cycle to20Control the process parameters in minutes, regulate the fluctuation of copper ion concentration, and significantly reduce the scrap rate.

2 工作原理：碘量法

This device adoptsIodometric method combined with potentiometric titrationBy monitoring the changes in oxidation-reduction potential in real-time through electrodes, the titration endpoint can be accurately determined

1. Sample pretreatmentAutomatically extract and filter plating solution, add buffering agent and masking agent to eliminate interferences.

2. Iodination reactionAdd the solution and undergo an oxidation-reduction reaction.

3. titrationPrecision titration pump injectionNa₂S₂O₃Standard solution.

4. Terminal determinationIntelligent algorithm recognition of electrode monitoring solution potential and equivalent points, the entire process is carried outWeakly acidic environmentProceed below to avoid disproportionation reaction and decomposition of titrant in strong acid environment..

3 core advantage

• No manual errorEliminating subjective bias in determining the endpoint of visual titration significantly improves data reliability.

• quick response：15-20Complete a single analysis in minutes and block production deviations in real-time

• High degree of automationAutomatic sampling, automatic reagent addition, automatic titration, automatic analysis, automatic cleaning

• Multi-scenario adaptationResistant to high temperature, strong acid, and high turbidity plating solution environment

• closed-loop control: Output4-20mA/ModbusSignal, automatically adjust copper ion concentration through the upper computer

4 Technical Specifications

5 Reagents and consumables

• Main reagents：

• 
  

• consumable life：

• Electrode:12Month (daily)8Secondary measurement)

• Pump pipe:3-6month

6 intelligent control system

• Full process automation：

• timing/Trigger dual-mode startup

• filterAutomatic samplingpHadjusttitrationTerminal determinationdata storagewash

• Self-diagnostic function：

• Real time monitoring of pipeline blockage

• Warning of insufficient reagent remaining

• Electrode activity decrease alarm (slope)<50mV/s）

7 Installation and Maintenance

• Device dimensions：600×500×230mm ABS

• Installation method: Wall mounted/Platform mounted, horizontal distance from plating tank≤5m(Sample circulation pump is required for long-distance use)

• routine maintenance：

This device passes throughIodometric method for electrode titrationInnovative applications provide high-precision and low maintenance online solutions for acid copper plating solution management, helping electroplating enterprises achieve“Experience driven”to, toward, at, facing“data-driven”The transformation of intelligent manufacturing.

noteFor specific reagent formulas, communication protocols, and installation dimensions, please refer to the appendix of the operating manual or contact the technical department for customized solutions.