Chip manufacturing testing equipment

Chip manufacturing testing equipmentThe enhanced reliability and improved performance of the MRD high-resolution X-ray diffractometer have improved its analytical capabilities, providing an integrated solution to meet different needs and applications
Semiconductors and Single Crystal Circles: Exploration of Inverted Space and Analysis of Swinging Curves
Polycrystalline solids and thin films: texture analysis, reflection measurement
Ultra thin films, nanomaterials, and amorphous layers: grazing incidence phase identification, in-plane diffraction
• Measurement under non ambient temperature conditions: peak height varying with temperature and time
Chip manufacturing testing equipmentFeatures:
X'Pert3MRD has been specially designed to meet the requirements of modern materials research and development laboratories. The development of X'Pert3MRD focuses on the needs of thin film applications, therefore providing multiple sample racks that can accommodate wafers with a diameter of up to 200 mm and can also be used for multi-point scanning of wafer surfaces. Its large sample stage can load multiple samples.

The X'Pert3 MRD incorporates new technology into the bearing design and position coding of the angle measuring instrument, thereby improving overall performance. The innovative results applied to the bearings of the angle measuring instrument have improved the viscous sliding behavior, enabling extremely smooth rotational movement even under high load conditions. A Heidenhain optical encoder was used on the omega and 2theta axes, resulting in improved accuracy for both short and long distances, as well as increased speed for position reporting and goniometer positioning.

The X'Pert3 MRD's European pull ring sample stage enables high-precision, repeatable, and unobstructed movement, facilitating sample rotation, tilting, and x-axis, y-axis, and z-axis translation, ensuring versatile and accurate sample positioning for demanding XRD applications.
The concept of a pre calibrated and quickly replaceable X-ray module enables MRD to be configured without the need for recalibration. When experimental requirements change, new PreFIX components can be easily added, making the entire solution flexible, fast, and capable of meeting future needs. We offer a wide selection of PreFIX modules, including:
X-ray parallel light reflector
Polycrystalline monochromator
High resolution four crystal monochromator
Multi capillary lens
Programmable and fixed diverging and anti scattering slits
Cross slit and single capillary optical devices
The detector product portfolio is constantly evolving. The PIXcel3D detector has special advantages in semiconductor and thin film applications, with complete multifunctionality that allows for high dynamic range measurements without the need for beam attenuation. The PIXcel detector can be used for various application requirements and can be easily switched from 0D receiving slit mode to 1D and 2D static and scanning modes.
application
Semiconductor and single crystal round
The process of measuring the quality, thickness, stress, and alloy composition of structural layers using high-resolution XRD has become the core of the development of electronic and optoelectronic multilayer semiconductor devices, whether for growth research or equipment design.
With a variety of available X-ray mirrors, monochromators, and detectors, X'Pert3 MRD and X'Pert3 MRD XL offer high-resolution configurations to accommodate different material systems. From lattice matched semiconductors, to relaxation buffer layers, and to novel foreign layers on non-standard substrates.

Polycrystalline solids and thin films
Polycrystalline thin films and coatings are important components of many thin film and multilayer equipment. The evolution of polycrystalline layer morphology during sedimentation is a key research area in the development of functional materials.
The X'Pert3 MRD and X'Pert3 MRD XL can be fully equipped with a series of incident light path components such as slit systems, parallel X-ray reflectors, multi capillary lenses, cross slits, and single capillaries to meet the needs of reflection measurement, stress, texture, and phase identification testing.

Ultra thin films, nanomaterials, and amorphous layers
Functional devices may contain disordered, amorphous, or nanocomposite thin films. The flexibility of the X'Pert3 MRD and X'Pert3 MRD XL systems allows for the combination of multiple analytical methods.
We can provide a range of high-resolution optical devices, slits, and parallel plate collimators to ensure higher performance for grazing incidence, in-plane diffraction, and reflection measurements.

Measurement under extreme temperature conditions
Studying the changes of materials under various conditions is an important component of material research and process development.

The X'Pert3 MRD and X'Pert3 MRD XL have been specifically designed to easily integrate with Anton Paar's DHS 110 variable temperature sample stage, enabling automatic measurements across a range of temperature ranges and inert gas environments.