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Atomic layer deposition system

NegotiableUpdate on 05/06
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Overview

SAL1000G is a small desktop ALD atomic layer deposition system with a glove box, which has good uniformity and * step coverage performance, allowing users to accurately control the deposition of each atomic layer. Through the glove box, operations can be carried out in an inert gas environment and prevent inhalation of nanoscale particles. This device is a small and cost-effective model that combines with the host and control power supply, pursuing easier operation only on the desktop. It can handle the deposition of up to 4 "wafers and take safety measures for each component.

Product Details

SAL1000GAtomic layer deposition systemFeatures:

-Diversity-

·The vacuum movable glove box can handle samples that are prone to oxidation.

·The precursor comes standard with two sets of valves and gas cylinders.

·You can choose to heat the precursor to 200 degrees Celsius.

·The automatic rotation bracket for the substrate can be selected.

·Powder deposition accessories can be selected.

·You can choose cost-effective exhaust gas treatment equipment.

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-Performance-

·Ensure the deposition of each uniform atomic layer pinhole free layer on the substrate surface.

·Depositing on uneven or 3D shaped surfaces through stepped coverage.

·Compared with CVD and PVD, better deposition can be achieved, especially for materials with higher aspect ratios and porous deposition.

-User friendly interface-

·The touch screen allows users to easily set formulas or deposition processes, and check the movement of each drive system.

·It can perform automatic sedimentation and automatically discharge N2 after sedimentation is completed.

·The vacuum exhaust and introduction of inert gas in the glove box can also be automatically completed.

-Security-

·This is an advanced device with various interlocking functions.

-The top hatch with gentle closing function allows users to easily load and unload substrates.

SAL1000GAtomic layer deposition systemTechnical parameters:

performance

真空度

Reaching pressure

≤5Pa

成膜性能

Film thickness distribution

≤± 3% (φ 100mm)

Equipment Composition

Device Model

SAL1000G

Film-forming direction

lower surface

Base size

φ 100mm or 4 inch Max

Base heater temperature

350℃ Max

Number of precursors

2

Precursor temperature

150℃ Max

purified gas

N2 (gas control: needle valve with flow meter)

glove box

Organic glass, vacuum nitrogen blowing type

vacuum pump

162L/min rotary vane vacuum mechanical pump

weight

本体: 50kg, 手套箱: 35kg, 真空泵: 27kg

Optional configuration

Automatic rotation bracket for substrate

Powder deposition accessories

Waste gas treatment equipment

Precursor heater -200 ℃

Installation requirements

Power requirements

power supply

3-phase, 200V ± 10%, 15A, 50/60Hz

grounding

<100Ω

cable

5m bonus

N2 purge gas

supply pressure

0.1 ~.0.2Mpa

interface

1/4 Swagelok

compressed air

supply pressure

0.6 ~0.8Mpa

interface

6mm interface

Vacuum pump exhaust port

exhaust vent

KF-25 flange

Equipment exhaust port

exhaust vent

φ 38mm x L28 hose adapter

installation dimensions

W1000 x D700 x H900