AC method thermal diffusivity measurement system

NegotiableUpdate on 05/06

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Overview

The AC method thermal diffusivity measurement system LaserPIT measures the thermal diffusivity coefficient of thin plate materials in the plane direction by scanning laser heating method; For high thermal conductivity materials, sub micron thin films can also be measured. Characteristics: 1 Accurately measure the thermal diffusivity from diamonds to polymer sheets; 2. Suitable for various materials with a thickness of 3-500um specimens; 3. The thermal conductivity of thin films deposited on the test plate at 100-1000nm can be measured by the differential method; 4. Easy to operate; 5. Specialized software for control, measurement, and analysis;

Product Details

AC method thermal diffusivity measurement systemTechnical parameters:
1. AC power supply: laser diode (wavelength 685nm, output power 30mW)

2. Illumination position: ± 3000 μ m, step size 1 μ m;

3. Frequency: 0.1~20Hz

4. Measurement accuracy of thermal diffusion coefficient: ± 5%

(Measure an independent sample)

5. Sample size: L 30mm, W 2.5~5mm t 3~500 μ m t 100~1000nm (thin film on substrate)

The * value of the sample thickness depends on its thermal conductivity;

6. Thermocouple type: E-type thermocouple;

7. Test atmosphere: vacuum (<0.02Pa), atmosphere;

8. Temperature range: Room temperature (R type) -200 ℃ (M2 type)

9. Interface: RS232C

10. Power requirements: AC100V, 15A;

11. Dimensions: W 350 x D 500 x H 330 (mm) mainframe, excluding protruding parts;

AC method thermal diffusivity measurement systemApplication:

1. Measure the thermal diffusion coefficient of materials with high thermal conductivity thin plates; CVD diamond, aluminum nitride, etc. (thickness<500 μ m);

2. Measure the thermal diffusion coefficient of metal sheets; Copper, nickel, stainless steel, etc. (thickness<5 μ m);

3. Measure the thermal diffusivity of materials with low thermal conductivity; Glass, resin materials, etc. (thickness<50 μ m);

4. Measure the thermal diffusion coefficient of anisotropic graphite sheets; Polyimide and polymer films (thickness<100 μ m) such as PET; (Thickness<5 μ m)

5. Measure the thermal diffusion coefficient of aluminum nitride and aluminum oxide thin films deposited on the substrate;

6. Measure the thermal diffusion coefficient of DLC films deposited on glass substrates;

7. Measure the organic pigment film deposited on the PET substrate;

8. Evaluate various sputtering target materials;

The measurement conditions may vary depending on the material and physical properties of the sample, and the above mentioned is a broad standard;
Measurement of Thermal Conductivity of Thin Films (Differential Method)

The thermal conductivity of a thin film deposited on a substrate can be obtained by measuring the thermal diffusion coefficients of the coated and uncoated areas on the same surface of the substrate. The factors that affect the thermal conductivity of thin films include:

Measurement results of coated and uncoated areas;

Measure the thickness and volumetric specific heat capacity of the substrate;

The thickness and volumetric specific heat capacity of the film;