The usage process of plasma cleaning machine mainly includes several core steps, such as preparation, parameter setting, operation and operation, and final processing. as follows:
1、 Preparation work
1. Equipment inspection: Ensure that all components of the plasma cleaning machine are intact, the power plug is correctly inserted and the voltage meets the requirements (usually AC220V ± 10%), the gas supply is sufficient and the connection is leak free. Check whether the gas pipelines (such as argon, oxygen, nitrogen) are tight, and check the sealing by applying soapy water to the joints to detect bubbles. At the same time, it is necessary to ensure that the equipment is well grounded to avoid the risk of electrical leakage.
2. Sample preparation: Clean the large impurities (such as dust and oil stains) on the surface of the sample to be cleaned, and wipe it with anhydrous ethanol before drying. Fix the sample on the sample holder, ensuring that the surface is unobstructed and evenly exposed to the plasma, and then place it in the center of the reaction chamber, avoiding proximity to the electrode. For small objects, fixtures or trays can be used to secure them and prevent them from moving during the cleaning process.
3. Environment and consumables confirmation: Open the fume hood or exhaust device to avoid gas pollution caused by plasma reactions. Check the pressure of the gas cylinder (usually maintained at 0.2-0.5MPa), confirm that the sealing gasket of the reaction chamber door is clean and undamaged, and that there is no strong vibration or dust in the experimental environment.
2、 Parameter settings
1. Mode selection: Choose the appropriate working mode (such as conventional cleaning, deep cleaning) or gas type (such as oxygen for oil removal, argon for surface activation, and a mixture of argon and oxygen for composite cleaning) according to the cleaning needs.
2. Parameter adjustment:
-Power: Choose high power (such as 300W) for hard samples, and low power (such as 50W) for soft or thermally sensitive samples;
-Time: For mild pollution, set a short time (30-2 minutes), and for severe pollution, extend it to 10 minutes;
-Vacuum degree: usually maintained within the range of 10-100Pa;
-Gas flow rate: generally set to 10-50 sccm to avoid excessive flow rate damaging the vacuum or insufficient plasma concentration [^ 2 ^]. Some models support segmented parameter settings (such as low-power preprocessing followed by high-power cleaning).
3、 Start running
1. Vacuum pumping: Close the reaction chamber door, start the vacuum pump, and pump the pressure inside the chamber to the set value (such as 20Pa). After completion, the instrument will automatically prompt (indicator light on or beep).
2. Ventilation ionization: Introduce working gas and maintain a stable flow rate, start the RF power supply to excite the gas and generate plasma. At this point, a faint glow will appear inside the reaction chamber, which is a normal phenomenon.
3. Real time monitoring: Observe parameters such as vacuum degree, gas flow rate, power, and remaining time through the screen to ensure no abnormalities (such as vacuum degree not meeting standards or gas leakage). Some models have automatic alarm function and will shut down for protection in case of abnormalities.
4、 End processing
1. Shutdown and pressure relief: After cleaning, turn off the RF power and gas valve, and the instrument will automatically enter the pressure relief process (introduce a small amount of inert gas to balance the internal and external pressures). The chamber door can only be opened after the pressure relief is completed.
2. Pick up inspection: Wear protective gloves to take out the sample, observe the surface condition (such as whether it is dry and free of residue), and verify the cleaning effect through water droplet contact angle test. If multiple samples need to be processed continuously, the steps of "vacuuming → cleaning" can be repeated directly without turning off the main power.
3. Cleaning and maintenance: Use a clean cloth to wipe the sealing gasket and sample holder of the reaction chamber door, and clean the dust residue inside the chamber. Close the gas cylinder valve, stop the vacuum pump and cut off the main power supply to complete the closing.
The operation process of plasma cleaning machine is standardized and intelligent, with the core being pre preparation and parameter adaptation. Users need to flexibly adjust parameters based on the sample material (hard/soft, temperature resistance) and cleaning objectives (oil removal, activation, etching), while strictly adhering to safety regulations (such as wearing goggles and gloves). Regular maintenance of equipment (such as checking sealing and cleaning reaction chambers) can significantly extend the service life of the machine and ensure the stability of cleaning effectiveness.