1、 Daily cleaning

After each process is completed, the surface residue of the heating table must be cleaned immediately. Dip a high-purity dust-free cloth into electronic grade acetone or isopropanol, gently wipe the tabletop to remove photoresist, metal residue, or particulate matter. It is strictly prohibited to use hard tools to scrape, in order to avoid scratching the precision temperature control area or damaging the surface coating. For stubborn residues, ultrasonic cleaning (if disassembly is allowed) or specialized adhesive removal solution can be used for treatment. After cleaning, ensure that it is dry before putting it into use.

2、 Temperature calibration

Temperature calibration must be performed every 1-3 months or after 200 hours of cumulative operation. Using a high-precision surface thermometer certified by metrology (such as an infrared thermometer or thermocouple probe), compare and measure at multiple key points (center, edge, four corners) on the table, and draw a temperature distribution map. If the temperature difference exceeds the allowable range of the process (usually ≤± 1 ℃), it is necessary to perform multi-point calibration through the control system or contact the manufacturer to adjust the PID parameters. Regular calibration can effectively prevent process deviations caused by thermocouple aging or uneven heating.

3、 Heating element and sensor inspection

Check the heating wire or ceramic heating module every six months for any signs of breakage, oxidation, or localized overheating; Observe whether the temperature control sensor (thermocouple or RTD) has good contact and no looseness. If the performance of the component is found to have decreased, the original accessories should be replaced in a timely manner to avoid damaging the wafer or causing safety accidents due to local overheating.

4、 Maintenance of table flatness and adsorption performance

For heating tables with vacuum adsorption function, regularly check whether the vacuum holes are blocked and use compressed air to blow and clean them in reverse. Check the flatness of the tabletop using an optical flat crystal or micrometer. If the deformation exceeds the standard, it needs to be ground and repaired. Ensure that the vacuum sealing ring is free of aging and cracks, and replace it if necessary to maintain uniform adhesion and prevent wafer warping or sliding.

5、 Electrical and control system inspection

Check if the power cord and wiring terminals are loose or oxidized; Confirm reliable grounding to prevent static electricity accumulation. Verify if the temperature control program, over temperature protection, and alarm functions are responding properly. Prevent voltage fluctuations from affecting temperature control stability.