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Nano Nuo 3D Nanoscribe: A High Precision Solution for Photon Encapsulation Micro Nano 3D Printing
Date: 2025-10-31Read: 1
With the trend of photon integration technology upgrading towards high density and high bandwidth, photon packaging has put forward strict requirements for the accuracy, complexity, and adaptability of micro nano structures. Traditional processing methods are difficult to balance "nano level coupling accuracy" and "three-dimensional structural flexibility". However, Nano Nuo 3D Nanoscribe's photon packaging micro nano 3D printing solution based on two-photon grayscale lithography technology is solving the processing problem of photon packaging with the core capabilities of "full structure coverage+high-precision control+scene adaptation".
This solution is designed specifically for 2GL ® With two-photon grayscale lithography technology as the core, an integrated system of "equipment software process service" is constructed to accurately match the three core processing requirements of "coupling structure, interconnection channel, and micro optical components" in photon packaging. In terms of technical architecture, through the deep collaboration of high-frequency laser galvanometer and 100MHz dynamic voxel adjustment technology, maskless direct writing 3D printing is achieved: the laser beam can accurately scan according to the digital design path, real-time control the voxel size and energy, and can form three-dimensional micro nano structures at once without the need for multi-layer slicing. This not only avoids the cycle delay caused by mask preparation, but also flexibly adjusts the structural parameters, perfectly adapting to the research and production rhythm of "small batch, multiple iterations" in photon packaging.
In response to the key technical requirements for photon packaging, the solution has three core capabilities: firstly, ultra-high precision coupling structure processing. The processing resolution is as low as below 100 nanometers, with optical grade surface roughness (Ra<5nm). It can directly print micro lens arrays, gradient refractive index lenses (GRIN lenses) and other structures required for fiber chip and chip chip coupling. In practical applications, the coupling loss of photonic devices can be controlled within 1.5dB, meeting the low loss requirements of optical communication and quantum photonics; Secondly, multi material compatibility and heterogeneous integration. Supporting commonly used substrates for photon packaging such as photoresist, glass, silicon-based materials, and biocompatible materials, the integrated printing of "micro optical structure+conductive interconnect channel" can be achieved on the same chip, solving the alignment problem of step-by-step processing of different materials in traditional processes; Thirdly, cross scale structural manufacturing. It can achieve both nanoscale fine features (such as photonic crystal aperture<200nm) and millimeter scale overall structures (such as microfluidic optical chips), adapting to the full-size processing requirements from photonic chip packaging to integrated optical modules.
In terms of scene adaptability, the solution covers the entire process of photon packaging from research and development to mass production. Targeting universities and research institutions, we support rapid iteration of customized micro nano structures and can complete the prototype preparation of new photon coupling structures within 1-2 days, assisting in the research and development of cutting-edge technologies such as metasurfaces and quantum photonic devices; For the industrial end, small batch production of optical communication micro lens arrays, MEMS optical switches, and other devices can be achieved through a 6-inch wafer level processing platform and automated process design, without the need to change masks to switch product models. The production efficiency is increased by more than 30% compared to traditional processes.