Motorcycle passenger helmet fixing deviceApplicable standards for stability testing machine: applicable to the requirements of EN 1077, EN 1078, ECE R 22.05 and GB 811-2010 standards; It is to apply a certain initial load force to the rear of the helmet, and then use a standard weight to drop from a certain height so that the impact force is also applied to the helmet, in order to evaluate the stability performance of the helmet wearing.
Equipment functions and testing principles:
Stability testing:
Simulate the displacement of the helmet during impact by freely falling weights to determine whether it has detached from the head mold. For example, a 10kg weight is dropped from a height of 500mm (Class A helmet) or 175mm (Class B helmet) to test the helmet's anti rollover ability.
Some devices need to simulate the initial pressure when worn with an initial load (such as 3kg), and then apply impact force.
Dynamic and static testing:
Dynamic testing: Evaluate the stability of the helmet during movement through the impact of a falling hammer.
Static testing: Measure the strength of the strap through a stretching device to ensure that the wearing device does not deform or break when subjected to force.
Daily cleaning and dust prevention:
Shell and sensor: Use a dry soft cloth to wipe the surface of the device to avoid dust accumulation and affect the accuracy of the sensor. If there are stains on the lens or display screen, a neutral cleaner can be used to gently wipe it, and the use of alcohol or corrosive solvents is prohibited.
Weights and impact components: Regularly check the surface of the weights for rust or wear, and apply rust proof oil if necessary; The impact head (such as a hammer) should be kept clean to avoid residue affecting the test data.
Electrical system maintenance:
Line inspection: Regularly check whether the power and signal lines are aging or loose to avoid short circuits or poor contacts.
Ventilation and heat dissipation: When the equipment is running, it is necessary to maintain ventilation to avoid the performance degradation of electronic components caused by high temperature.