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thermal shock chamber

NegotiableUpdate on 12/25
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Overview
The thermal shock test chamber is used to test the degree to which material structures or composite materials can withstand continuous environments of high and low temperatures in an instant, in order to test the chemical changes or physical damage caused by thermal expansion and contraction in a short period of time. Used for physical transformations in industries such as electronic and electrical components, automation parts, communication components, automotive parts, metals, chemical materials, plastics, defense industry, aerospace, military industry, BGA, PCB substrates, electronic chip ICs, semiconductor ceramic magnets, and polymer materials,
Product Details

thermal shock chamberProduct Description:

1. Applied to adaptability testing of semiconductor devices and electronic products under conditions of rapid changes in ambient atmospheric temperature.

2. Vertical two box structure, automatic control of high and low temperature box circulation process, adjustable dwell and transition time, stainless steel inner tank, multi form recording, equipped with various safety protection measures and devices.

3. Meets MIL-STD-810D method 032, GB2423.22-89Na, GJB1505-86, etc.

thermal shock chamberMain technical parameters:

Product Description:

1. Applied to adaptability testing of semiconductor devices and electronic products under conditions of rapid changes in ambient atmospheric temperature.

2. Vertical two box structure, automatic control of high and low temperature box circulation process, adjustable dwell and transition time, stainless steel inner tank, multi form recording, equipped with various safety protection measures and devices.

3. Meets MIL-STD-810D method 032, GB2423.22-89Na, GJB1505-86, etc.

Technical Specifications:

Temperature shock test chamber

CTS01

CTS03

CTS05

Studio size (mm)

470× 470× 460

680× 680× 650

780× 780× 850

Basket size (mm)

350× 350× 300

580× 580× 500

680× 680× 700

Dimensions (mm)

2000× 1100× 1650

2350× 1360× 2000

2500× 1580× 2200

skill

technique

ginseng

number

temperature range

high temperature

+ 60℃~ 150℃

low temperature

- 70℃~- 10℃

Temperature preheating upper limit/pre cooling lower limit

+ 180℃ /- 75℃

Temperature fluctuation/temperature deviation

± 0.5℃ /± 2℃

Heating time/cooling time

45min( 20~ 150℃) /45min( 20~- 55℃)

Temperature recovery time

≤ 5 minutes

Carrying basket load-bearing capacity

10Kg

18Kg

25Kg

Temperature Controller

Imported programmable temperature controller

temperature sensor

Pt100 platinum resistor

refrigeration
system

Refrigeration unit/method

Imported German valley wheel semi closed compressor unit/binary cascade compression refrigeration

cooling method

Water cooling (cooling water pressure: 0.2-0.4MPa, water temperature: ≤ 30 ℃)

condenser

plate heat exchanger

Heater, cooler

Nickel chromium alloy electric heater, finned cooler

circulating fan

axial flow fan

Pneumatic cylinder

Basket in high and low temperature chamber conversion driver

air compressor

Provide compressed air for driving the cylinder (optional)

Security protection measures

Overtemperature, overload, overvoltage, leakage, short circuit, power phase loss, phase error protection

material

Shell/inner wall/insulation material

Cold rolled steel plate electrostatic spraying/SUS304 stainless steel plate/rigid polyurethane foam or ultra-fine glass wool

Standard Configuration

Test hole, lighting lamp, observation window, insulated glass observation window with electroplated heating film

power supply

380V± 10%, 50Hz, 3P+ N+ G

Meet the test method

GB/T2423.22、 GJB150.5、 GJB360.7、 GJB367.2