X-ray inspection packaging chip

X-ray inspection packaging chipXIS1000

X-ray inspection packaging chipXIS1000It is a non-destructive testing equipment with strong universality and high detection accuracy, which has good detection effect and can easily meet the product testing needs of different users from multiple directions and angles. It is mainly used for observing internal defects in semiconductor component production, electronic product processing, electronic product packaging, power supply, injection molded parts, battery capacitor industry, and actual substrate industries. It can also be used for testing in special industries such as automotive parts, aluminum die-casting molds, photovoltaic industry, and molded plastics, ceramic products, etc., allowing users to easily identify defective products

X-ray inspection packaging chipXIS1000A high-precision non-destructive testing tool specially designed for small and medium-sized workpieces, focusing on circuit boards and die-casting partsDefect analysis can be seamlessly integrated with XRF instruments to achieve one-stop co measurement of "element composition+internal structure", ensuring "safety, efficiency, intelligence, and collaboration"Breaking through the blind spots of traditional testing, providing a full chain quality control solution for industries such as electronic manufacturing and precision die-casting.

X-ray inspection packaging chipAdvantages of XIS1000

160kV maximum tube voltage+1.25mA tube current, easily penetrates materials such as cast iron/steel (10-15mm), aluminum (60-80mm), etc. Digital static imaging technology makes defects clear and visible, with a recognition rate of ≥ 95%, accurately capturing issues such as virtual soldering/short circuits on circuit boards, air holes/cracks in die-casting parts, etc.

Multiple safety devices such as door interlock, emergency stop button, warning light, radiation alarm, etc. stop the beam upon opening the door. The maximum radiation dose rate at 30cm outside the equipment is only 0.306 μ Sv/h, which is much lower than the national standard (≤ 2.5 μ Sv/h) and complies with GBZ 117-2022, GBZ/T 250-2014, etcStandard requirements.

The integrated design does not require additional protective rooms, with a compact body of 810 × 780 × 1800mm and a sample chamber of 450 × 400 × 560mm, suitable for small and medium-sized workpiece testing. It can be flexibly deployed in laboratories and production lines.

The human-machine interface is user-friendly, supporting one click operation, which can achieve image storage, data export, and report generation. Paired with XRF collaboration process, it simplifies the operation process and reduces the threshold.

X-ray inspection packaging chipXIS1000 Application Scenarios