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Huahan Technology Industrial Park, No. 19 Lanjin Fourth Road, Pingshan District, Shenzhen
Shenzhen Pu Ce Testing Technology Co., Ltd
Huahan Technology Industrial Park, No. 19 Lanjin Fourth Road, Pingshan District, Shenzhen
Electroplating coating thickness gaugeEDX2000A

Electroplating coating thickness gaugeEDX2000A It is a bottom illuminated coating thickness gauge specially developed based on years of experience in X-ray fluorescence thickness gauges. Not only can it accurately measure various conventional shaped coating products, but it can also test various difficult to measure shaped parts. It can be widely used in the photovoltaic industry, hardware and bathroom, electronics and electrical, aerospace, magnetic materials, automotive industry, communication industry and other fields.
Electroplating coating thickness gaugeEDX2000A hardware configuration
The combination of high-power and high-voltage units with micro focal spot X-ray tubes greatly ensures the efficiency and stability of signal output.
EDX2000A can accurately analyze different elements and has unparalleled advantages in measuring multi coating and complex alloy coatings.
In terms of collimator selection, EDX2000A also has great advantages. It can be equipped with smaller collimators: 0.1 * 0.3mm, 0.15mm in the middle, 0.2mm in the middle, 0.3mm in the middle, 0.5mm in the middle, and so on. The ultra small light spot obtained with an ultra small collimator makes it easy to measure smaller samples.
Electroplating coating thickness gaugeEDX2000A Product Features:
1. Professional coating thickness detector, using high-resolution Si PIN (or SDD silicon drift detector), with measurement accuracy and results in the industry.
2. Adopting FlexFP Multi technology, we provide a friendly experience and meet the testing needs for quality control in the production process, as well as random sampling and inspection in incoming material inspection and material performance testing.
3. The micro mobile platform is paired with a high-definition CCD, and the knob adjustment design is located outside the housing, making it easy and convenient to observe the movement position.
4. The application of X-ray fluorescence technology to test the thickness of coatings has improved the inspection conditions for large-scale production of electroplated products, with non-destructive, rapid, and superior characteristics, providing assurance for quality improvement in the electronics and semiconductor industries.
5. The coating thickness gauge adopts Huawei's new technology FlexFp Multi, which is not limited by standard samples and can directly test the coating thickness of samples without coating standards. The test results can withstand scientific verification.
6. The sample movement is designed for external adjustment of the sample chamber, making it convenient and fast to move the sample during multi-point testing, which helps to improve efficiency.
The design is more scientific, with software and hardware coordination, electromechanical linkage, and radiation safety higher than the requirements of GBZ115-2002 standard.
7. The software operation has hierarchical management permissions for operators. Generally, operators and supervisors use different usernames and passwords to log in, and the test records automatically add the login name of the tester.
Electroplating coating thickness gaugeEDX2000A Product metrics:
Thickness measurement technology: X-ray fluorescence thickness measurement technology
Test sample types: metal coating, alloy coating
Measurement lower limit: 0.003um
Measurement upper limit: 30-50um (determined by material element)
Measurement layer: 10 layers
Measurement time: 30-120 seconds
Detector type: Si PIN electric refrigeration
Detector resolution: 145eV
High voltage range: 0-50Kv, 50W
X-ray tube parameters: 0-50Kv, 50W, side window type;
Light tube target material: Mo target;
Filter: Three types of dedicated automatic switching;
CCD observation: 2.6 million pixels
Micro movement range: XY15mm
Input voltage: AC220V, 50/60Hz
Test environment: Non vacuum conditions
Data communication: USB 2.0 mode
Electroplating coating thickness gaugeEDX2000A Design highlights
