Wafer transfer

Wafer transferCorresponding to FOUP (loading port) and FOSB, suitable for low-cost post inspection. The safe and ergonomic design ensures the efficiency and safety of operators when transporting wafers, including thin and deformed wafers.

Ergonomic design, easy to operate

The inspection mode that can be freely set has been designed with consideration for operability in downstream engineering, with particular emphasis on the ease of equipment operation.

Corresponding to both FOUP (Load Port) and FOSB models.

Wafer transferSturdy, reliable, and secure transmission

Continuing the robustness, reliability, and safety of the previous generation model, it can safely and reliably transport 300mm wafers.

Thin films and Warped wafers can be safely transported.

The standardization of macroscopic observation positions and the centralized arrangement of operating units have improved the comfort of equipment operation.

Provided an ideal illumination method for the discovery of foreign objects, scars, membrane spots, and defocusing

The combination of high brightness metal halide light source and fiber optic illumination achieves comprehensive illumination of 300 mm wafers with cold light source.