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Qianwan 1st Road, Qianhai Shenzhen Hong Kong Cooperation Zone, Shenzhen
Shenzhen Simi Technology Co., Ltd
Qianwan 1st Road, Qianhai Shenzhen Hong Kong Cooperation Zone, Shenzhen
Technical parameters of impact specimen notch projector
The automatic impact notch measuring instrument is developed by our company based on the actual needs of our customers, in accordance with GB/T229-2007 "Charpy Pendulum Impact Test Method for Metallic Materials", ISO 148-1 2009 "Charpy Pendulum Impact Test Machine for Metallic Materials Part 1: Test Method" ASTM E23-2018, The newly developed specialized V2 and U2 notch processing inspection equipment, the "Automatic Impact Notch Measuring Instrument".
Technical parameters of impact specimen notch projector
At present, industries such as boilers, pressure vessels, metallurgy, and machinery in China have widely adopted the Charpy V-notch impact test instead of the decades old Meier U-notch impact test.
For the Charpy V-notch impact test, due to the strict requirements for the V-notch of the specimen (with a notch depth of 2mm, a 45 ° angle, and a notch requirement of R0.25 ± 0.025mm), whether the V-notch processing of the specimen is qualified becomes a key issue throughout the entire test process. If the processing quality of the notch is not qualified, the test results are unreliable, especially for small changes in the R0.25mm notch (with a tolerance band of only 0.025mm), which can cause a sharp jump in the test results, especially at the critical value of the test, it can lead to two completely opposite results: product scrap or qualified. To ensure that the processed Charpy V-notch is qualified, adding quality inspection to the notch is an important quality control measure. Recently, using optical projection magnification for inspection is a feasible and quality assured method.
The automatic impact notch measuring instrument can also be used for the contour analysis of mechanical components, textile fibers, biological slicing, inspection of cutting tools, and projection detection of instrument components and semiconductor components. Accurately measure the angle, depth, root radius, and longitudinal axis angle of the gap.