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Shenzhen Kyoto Yuqi Electronics Co., Ltd
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Shenzhen Kyoto Yuqi Electronics Co., Ltd

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    Entrepreneurship Building, No. 906 Meilong Avenue, Longhua New District

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Spot Japanese MUSASHI Musashi Glue Dispensing Machine MS-1

NegotiableUpdate on 05/06
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Overview

Spot Japanese MUSASHI Musashi Glue Dispensing Machine MS-1, a high-performance pocket sized glue dispensing machine $r $n, supplied by Kyoto Tamazaki Advantage. Welcome to inquire

Product Details

Spot Japanese MUSASHI Musashi Glue Dispensing Machine MS-1

Spot Japanese MUSASHI Musashi Glue Dispensing Machine MS-1

  • Basic Parameters

    • Control methodMicroelectronics/pneumatic methods.

    • Discharge pressure setting range:0.02~0.70MPa, Simulated display.

    • Spitting out time setting:10ms~9999sec., Controlled by LED 4-digit digital display switch.

    • Vacuum pressure setting range:0.0~-20.0kPa。

    • power supply:AC100~240V,50/60Hz, Power of 12W.

    • Dimensions and weightThe dimensions are 142mm × 139mm × 103mm and the weight is 790g.

  • Product Features

    • high precisionThrough microelectronics/pneumatic control, precise dispensing pressure and time settings can be achieved, and the dispensing accuracy is 130% higher than similar products.

    • low energy consumptionThe energy consumption is only half of traditional models, and the energy-saving effect is remarkable.

    • Easy to operateNo need for complex debugging, can be put into production immediately, supports manual operation, and can also be paired with automated production lines.

    • Anti drip designEquipped with a negative pressure generator and vacuum anti drip function, it can prevent glue dripping.

    • multiple modesEquipped with timed mode (quantitative dispensing) and manual mode (continuous dispensing), it can meet different dispensing needs.

    • Environmental complianceCompliant with RoHS and CE standards, meeting international environmental and safety requirements.

  • Scope of application

    • Adhesive typeCompatible with various adhesives, such as solder paste, silver paste, UV resin, instant dry adhesive, silicone resin, etc.

    • Application scenariosWidely used in fields such as electronics, automotive, medical equipment, etc., it can be used for fine processes such as fixing mobile phone camera modules, sensor packaging, and micro catheter bonding.