Sn42Bi58 lead-free low-temperature solder paste

1、 Product Introduction

Lead free low-temperature solder paste is a non cleaning solder paste designed for today's SMT production process. It is made by refining special flux and spherical solder powder with minimal oxide, and has excellent continuous printing resolution; The flux contained in this product adopts a highly reliable low ion halogen activator system, which has extremely high reliability and meets the RMA type specified in the US federal specification QQ-571.

2、 Product Features:
·Melting point 138 ℃ -183 ℃

·Fully compliant with RoHS standards
·Excellent printability, eliminating omissions, dents, and knots during the printing process
·Good wettability, bright, uniform and full solder joints
·Wuxi beads and tin bridges are generated during reflow soldering
·Long term adhesive life, long steel mesh printing life
·Suitable for wide process and fast printing
3、 Types of solder paste
·Classified by alloy type: lead-free solder paste and lead containing solder paste
·Classified by flux type: rosin type, no wash type, and water-soluble solder paste
·Classified by melting temperature of solder alloys: high temperature (217 ℃ -220 ℃), room temperature (183 ℃), and low temperature solder paste (138 ℃ -183 ℃)
·Classified by alloy particle size: (20um-38um), (25um-45um), (38um-63um)

4、 Ingredients and models of commonly used lead-free solder paste:
1. 3.0 Silver Lead free Solder Paste (Sn96.5/Ag3.0/Cu0.5)
2. 0.3 silver lead-free solder paste (Sn99/Ag0.3/Cu0.7)
3. Tin bismuth silver low-temperature solder paste (Sn64/Bi35/Ag1), tin bismuth low-temperature solder paste (Sn42/Bi58)