Desktop small reflow soldering QS-5180C

1、 Desktop lead-freereflow solderingProduct Introduction of Machine QS-5180C
Desktop lead-free reflow soldering machine QS-5180C（Reflow oven）It is a type of product used for the production and maintenance of various processes such as SMTDesktop reflow equipmentThis product uses high-efficiency far-infrared heating elements and distributed thermocouple temperature measurement devices. By precise control of the microcomputer, the temperature curve of the reflow furnace is controlled more accurately and the temperature of the reflow plane is more uniform. Fully adaptable to the reflow requirements of various alloys and lead-free solder materials. Its temperature curve is precisely adjustable, and the equipment also has functions such as automatic fault detection alarm and automatic shutdown. This product has multiple uses such as reflow, repair, and drying.Suitable for small-scale SMT electronic product production, trial production, electronic product development departments, school training classes, and other units.

desktopLead-free reflow solderingThe QS-5180C operating software is the latest bilingual operating system developed in both Chinese and English. The circuit structure adopts an efficient and convenient integrated switching power supply, and uses aluminum silicate high-temperature resistant and environmentally friendly insulation cotton. It has been improved and upgraded in terms of performance structure and operation.

2、 Desktop lead-free reflow soldering machine QS-5180C main technical parameters: 1. Input power supply: AC220V/(AC110V order)
2. Working frequency: 50-60Hz
3. Maximum input power: 1650W
4. Hybrid heating method of infrared radiation and hot air
5. Operating System: QS-5180CBilingual operation in Chinese and Englishsystem
6. Working mode: automatic reflow mode, adjustable constant temperature maintenance mode
7Temperature curve segments: preheating section, heating section, welding section, insulation section, cooling sectionFive paragraphs in total
8. Preheating section temperature setting range and time: 70-150 ℃, time: 0-5 minutes
9. Heating section temperature setting range and time: preheating section temperature~220 ℃, time: 0-5 minutes
10. Welding section temperature setting range and time: Heating section temperature~300 ℃, time: 0-30s
11. Temperature setting range and time for insulation section: Welding section temperature - (0-50 ℃)
12. Tray specifications:305x320mm
13. Dimensions: 460 × 372 × 275mm

3、 Desktop lead-freeReflow soldering machineThe Function and Function of QS-5180C Temperature Curve
In the production process of SMT, the temperature curve can be adjusted according to different alloy formulations of solder or solder paste, which is also a major parameter to ensure product quality. A typical reflow soldering typically has five temperature zones, and five temperature zones are usually set up in a box type reflow oven to simulate the five temperature zones of a tunnel type reflow oven. to ensureSMTDesign the temperature points and corresponding times for each temperature range based on different requirements of the PCB board. In order to better illustrate the requirements and functions of each temperature range, we will now describe each temperature range separately.

1：preheating sectionPurpose and Function
The purpose is to heat the PCB board to 120-150 ℃ at room temperature, which can fully evaporate the moisture of the PCB board, eliminate the stress and some residual gases inside the PCB board, and is a smooth transition to the next temperature range. The time is generally controlled within 1-5 minutes. The specific situation depends on the size of the signboard and the number of components.

2：heating sectionPurpose and Function
The PCB board processed through the preheating section needs to activate the flux in the solder paste during the heating process, and remove the oxides inside the solder paste and on the surface of the components through the action of the flux. Prepare for the welding process. At this stage, the temperature of lead alloy brazing materials and precious metal alloy brazing materials is usually set between 150-180 ℃, such as Sn42% - Bi58% tin bismuth alloy low-temperature lead-free brazing materials, Sn43% - Pb43% - Bi14% lead low-temperature brazing materials, etc. Lead alloy brazing materials with medium temperature are generally set at 180-220 ℃. High temperature lead-free alloy brazing materials are generally set between 220-250 ℃. If you have solder and solder paste materials on hand, the temperature of the heating section can be set to around 10 ℃ below the melting temperature point of the solder paste for optimal performance.

3：Welding sectionPurpose and Function
The main purpose of the soldering stage is to complete the SMT soldering process. As this stage is the highest temperature range in the entire reflow process, it is extremely easy to damage components that do not meet the temperature requirements. This process is also a complete reflow process, where the physical and chemical changes of the solder are the greatest, and the melted solder is highly susceptible to oxidation in high-temperature air. This stage is generally based on the melting temperature provided by the solder paste data, which is about 30-50 ℃ higher. Regardless of whether there is lead or lead-free solder, we generally divide it into low-temperature solder (150-180 ℃), medium temperature solder (190-220 ℃), and high-temperature solder (230-260 ℃). The commonly used lead-free solder materials nowadays are high-temperature solder materials, while low-temperature solder materials are generally lead-free solder materials for precious metals and low-temperature lead solder materials with special requirements. They are relatively rare in general electronic products and are mostly used in electronic devices with special requirements. Lead based medium temperature brazing materials have excellent electrical properties, physical and mechanical properties, resistance to thermal shock, and oxidation resistance. These properties cannot be replaced by various lead-free solder materials at present, so they are still widely used in general electronic products.

The duration of this stage is generally set according to the following requirements. After the solder melts at high temperature, it appears as a liquid, and all SMT components will float on the surface of the liquid solder. Under the action of flux and liquid surface tension, the floating components will move to the center of the solder pad and have an automatic straightening effect. In addition, under the wetting of the flux, the solder will form an alloy layer with the surface metal of the preform. Penetrating into the structural organization of the components to form an ideal brazing structure, the time is generally set at around 10-30 seconds. PCB boards with large areas and large component shading surfaces should be set for a longer time; Small area PCB boards with few components usually require a shorter setup time. In order to ensure the quality of reflow and shorten the time of this stage as much as possible, it is beneficial to protect the components.

4：Insulation sectionPurpose and Function
The function of the insulation section is to solidify high-temperature liquid solder into solid solder joints. The quality of solidification directly affects the crystal structure and mechanical properties of the solder. Too fast solidification time can cause the solder to form rough crystals, the solder joints to be rough, and the mechanical and physical properties to decrease. Welding points are prone to cracking and losing their mechanical and electrical connections under high temperature and mechanical impact, resulting in reduced durability of the product. We use to stop heating and keep the residual temperature warm for a short period of time. Let the solder solidify and crystallize well during the slow temperature drop process. This temperature point is usually set at around 10-20 ℃ lower than the melting point of the solder. By using the natural cooling time setting, after reaching this temperature point, it can enter the cooling section.

5：cooling sectionPurpose and Function
The function of the cooling section is relatively simple, usually cooling to a temperature that will not burn people. But in order to speed up the operation process, the process can also be ended when the temperature drops below 150 ℃. But when removing the soldered PCB board, it is necessary to use tools, hand straps, and heat-resistant gloves to prevent burns.

6：PrecautionsThe temperature curve is generally adjusted from low temperature, and the reflow temperature should be reduced as much as possible after meeting the reflow requirements. The temperature can also be reduced by appropriately extending the reflow time. This is beneficial for protecting low-temperature components, connectors, and plugs that are not heat-resistant. Some components do not meet the temperature requirements and can be solved by post soldering.

4Desktop lead-free reflow soldering machineQS-5180C usagePrecautions

1. Please use a dedicated power socket with a capacity of 15A or above separately. Do not share the same power socket with other appliances, and the power socket must be reliably grounded.Reflow ovenIt should be placed horizontally, with a gap of at least 20cm between the surrounding area and the wall.
2. Do not use the reflow oven in damp or high-temperature environments.
3. Do not rinse the body directly with water to avoid damaging the insulation performance of the body.
4. Do not insert or block foreign objects such as wire into air vents and exhaust vents to avoid burns or affecting ventilation and heat dissipation.
5. Please do not bring flammable or explosive dangerous goods near this areaReflow ovenItems containing flammable and explosive gases should not be dried to avoid danger.
6. Please avoid colliding with the body to avoid damaging the heating tube. If the heating tube is found to be broken, the power should be turned off and sent for repair.
7. When working or before the machine has cooled down to a safe temperature, do not put your hands into the chassis to avoid burns.
8. Please do not useReflow ovenUse it on a tablecloth to prevent blockage of the air inlet.