Small desktop reflow soldering QS-5128C

Main technical parameters

1Input power supply:AC220V/（AC110VOrder)

2Working frequency:50～60Hz

3Maximum power:600W

4Heating method: a mixed heating method of infrared radiation and hot air

5Operating System:QS-5128CBilingual Chinese and English, dual display operating system

6、Drawer area：230x180mm

7External dimensions:300x250x160mm

8Display mode: graphic mode/text mode

9Working mode: automatic reflow mode, adjustable constant temperature maintenance mode

10Temperature curve section: preheating section, heating section, welding section, insulation section, and cooling section, totaling five sections

11Temperature setting range and time for preheating section:70～150℃, time:0～5min

12Heating section temperature setting range and time: preheating section temperature~220℃, time:0～5min

13Welding section temperature setting range and time: Heating section temperature~280℃, time:0～30s

14Temperature setting range and time for insulation section: Welding section temperature-（0～50℃）

QS-5128CReflow soldering is a newly developed technique used in electronic products and maintenanceSMTConvenient reflow equipment for the process. This product uses far-infrared heating elements and temperature sensing elements. By precise control of the microcomputer, the temperature control curve of reflow soldering is fully in line withSMTRequirements for reflow soldering in production processes,“temperature curve”Precision adjustable to meet the solder paste requirements of different material parameters. can pass through“Settings”The function enables the device to have multiple functions such as reflow soldering, repair drying, etc.

The whole machine has two sets of operating parameters to choose from, namely“Reflow soldering”and“repair”.“Reflow soldering”It is designed for soldering circuit board components, and the entire operation process includes heating, insulation, (set soldering) temperature, and cooling;“repair”It is designed for disassembling circuit board components, with heating and insulation during operation“Reflow soldering”Compared to that, there is less cooling process.