Silicon wafer polishing machine (old model)

Introduction to Hyde Precision Machinery

1. Hyde focuses on providing high-precision flat grinding equipment, flat polishing equipment, and their grinding and polishing consumables; Undertake processing.

2. Free sample grinding and free design of grinding and polishing solutions; Hyde's numerous grinding and polishing case advantages provide a better understanding of how to reduce costs and improve efficiency, which can help companies achieve high efficiency and low costs.welcomeCall for consultation details:

3. We not only sell equipment, but also participate in customer research and development production. Our goal is to help customers achieve efficient mass production.

Silicon wafer polishing machineIt is one of the key products of Shenzhen Hyde Precision Grinding Machine Manufacturing Co., Ltd. Hyde has mature production technology, advanced production equipment, large sales volume, wide range, good quality, and good performance. It is the preferred supplier for enterprises, factories, and traders; The company has strong technical strength, exquisite production technology, advanced testing methods, and thoughtful after-sales service. buySilicon wafer polishing machineIdentify Shenzhen Hyde and provide lifelong maintenance! The sales network of silicon wafer polishing machine products covers all over the country. Welcome to inquire by phone!

Silicon wafer polishing machineworking principle:

This series of silicon wafer polishing machines uses four adsorption disks to adsorb silicon wafers and rotate counterclockwise with the polishing disk to achieve the purpose of polishing.

Silicon wafer polishing machinecharacteristic:

The adsorption disc of this series of polishing machines is driven by four separate motors, with adjustable speed and pressure.
2. The control system adopts advanced technologies such as PLC color terminals, which provide faster and more accurate response speed, as well as remote monitoring and maintenance functions;
3. This series of polishing machines runs smoothly, and the thickness tolerance of the polished products can be controlled within the range of plus or minus 0.002mm. The roughness can reach 0.0005mm