Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

1、 Basic concepts of chemical mechanical polishing (CMP):

CMP， Chemical mechanical polishing (CMP) is a technique that combines chemical and mechanical methods to precisely grind and polish the surface of silicon wafers. It is the hardware foundation of this technology that enables global planarization of silicon wafer surfaces, providing a solid foundation for subsequent processes. CMP equipment is a key process equipment in the semiconductor manufacturing field.

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

Semiconductor CMP cleaning 12 inch specialized ultrasonic flowmeter

1. Basic information of CMP equipment

1) Main processes of CMP

The CMP process includes three main steps: polishing, cleaning, and transfer. During the polishing process, the chemical components in the polishing solution react with the surface material of the wafer to form a thin film that can be mechanically removed. Subsequently, the polishing pad removes this thin film through mechanical action to achieve surface smoothness.

2) The main types of CMP equipment

CMP equipment can be divided into 8-inch, 12 inch, and 6/8-inch compatible devices according to application requirements.

3) The main application areas of CMP equipment

Mainly used in the field of semiconductor manufacturing, the semiconductor industry chain can be divided into four major links: wafer material manufacturing, semiconductor design, semiconductor manufacturing, and packaging testing. Except for the semiconductor design process, CMP equipment is also used in other fields:

① Wafer material manufacturing process: CMP equipment is required in the polishing process to obtain flat wafer materials.