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E-mail
hyder@szlapping.com
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134-8012-0112
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601, Unit A, Building B, Baoneng Zhichuang Valley, Huanan City, Pinghu Street, Longgang District, Shenzhen
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Shenzhen Shuncheng Technology Co., Ltd
Sapphire grinding fluid
NegotiableUpdate on 03/30
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Overview
Sapphire grinding fluid utilizes the characteristics of polycrystalline diamond to maintain high cutting efficiency during the grinding and polishing process without easily scratching the workpiece. It can be applied in the grinding and thinning of sapphire substrates, optical crystals, hard glass and crystals, superhard ceramics and alloys, magnetic heads, hard drives, chips and other fields for grinding and polishing.
Product Details
Sapphire grinding fluid(Also known as sapphire polishing solution) is a grinding solution used for grinding and thinning sapphire substrates.
Sapphire grinding fluidComposed of high-quality polycrystalline diamond micro powder, composite dispersant, and dispersion medium.
Sapphire grinding fluidBy utilizing the characteristics of polycrystalline diamond, high cutting efficiency can be maintained during the grinding and polishing process without easily scratching the workpiece. It can be applied in the grinding and thinning of sapphire substrates, optical crystals, hard glass and crystals, superhard ceramics and alloys, magnetic heads, hard drives, chips and other fields for grinding and polishing.
Application of Sapphire Grinding Liquid in Sapphire Substrate:
1. Double sided grinding of the substrate before epitaxial wafer production: Sapphire grinding solution is often used to grind one or more layers, and the final sapphire substrate grinding requirements vary from 6um, 3um, and 1um.
2. Thinning of the back of the LED chip
To solve the heat dissipation problem of sapphire, it is necessary to reduce the thickness of the sapphire substrate from around 450nm to around 100nm. There are mainly two steps: first, use a 50-70um grinding wheel on the horizontal thinning machine to grind off a thickness of about 300um; Then use a polishing machine (such as Xiuhe, NTS, WEC, etc.) to polish the back of the chip using suitable sapphire grinding solution (water/oil) for different grinding discs (tin/copper discs), reducing the size from 150nm to around 100nm.
Our company develops polishing solutions for various materials through professional laboratories, and can configure polishing solutions according to different materials. Welcome to inquire by phone:
