Precision grinding and polishing system

The DL series is LogitechhaveThe innovative processing solution is its latest highly automated intelligent sample preparation system. This system provides dynamic load control for Logitech intelligent pneumatic fixtures, enabling fast, reliable, and highly accurate results in a wide range of semiconductor applications.

*The automation significantly reduces setup and cleaning time, while the integrated software provides a user-friendly platform with precise and controllable machining functions. Logitech's intelligent pneumatic fixture utilizes air pressure to apply up to 40 kilograms of downforce to the chuck, and can achieve a rotation speed of up to 100 revolutions per minute, ensuring excellent sample loading performance throughout the entire process. These features can meet the needs of even the most demanding applications.

There are two configurations to choose from: DL81 model, equipped with a single workstation; DL82 model, equipped with two workstations. Independent system, equipped with boards with a diameter of 600/700 millimeters. Up to two precision pneumatic fixtures can be operated simultaneously to handle large individual samples or multiple smaller samples. The maximum size of the fixture fixed sample can reach 8 inches/200 millimeters, or the maximum size of the freely ground sample can reach 12 inches/300 millimeters.

Electric grinding fixtures can achieve high geometric accuracy and maintain stable rotation of the sample throughout the entire process, resulting in excellent and reproducible wafer uniformity.

The precision pneumatic fixture is equipped with an integrated chuck downforce calibration system and an automatic fixture lifting arm. The fixture can be installed on and lifted from the board, and flipped over to make the chuck face up for operators to process samples. The fixture can be programmed to automatically lift when the target removal amount is reached - thereby achieving automated operation and preventing excessive machining. The Material Removal Rate (MRR) can be monitored and controlled to micrometer level accuracy. The in-situ plate thickness monitor will evaluate and control the status of the plate. Processing in progress. The internationally recognized EtherCAT protocol is used to communicate with the main drive units to determine parameters useful for machine monitoring and diagnosis, while an industrial traffic lighthouse provides machine status alerts. Up to four cylinders can be accommodated for multi-stage machining. The increased capacity of the 3.8-liter cylinder means a longer, uninterrupted machining process that can be used for grinding and polishing slurries. The abrasive supply unit, measured by a peristaltic pump, allows operators to set a flow rate of 5 to 100 milliliters per minute. This greatly improves the quality and accuracy of the results, while reducing waste and operating costs. This systemisClosed and sealed, with exhaust port (diameter 150mm), allowing installation of extraction connections to handle hazardous materials such as gallium arsenide (GaAs) or indium phosphide (InP). Equipped with a maintenance crane for safe and easy handling of grinding and polishing plates. It can be lifted from the ground to the work area, with a maximum lifting weight of 200 kilograms and a stretching distance of 380 millimeters. Real time analysis and control of process parameters, including abrasive supply, through the system's graphical user interface (GUI). 15 inch display screen and touch screen user interface. This mode allows operators to create, save, and call multi-stage process recipes, ensuring that each process can be repeated, even under different operator operations. The integrated Logiwaste system is capable of efficiently processing mud waste. The heavy sedimentation tank is sealed and connected to the drip tray to prevent gas from escaping, and its connection method is easy to disassemble and remove for treatment. The heavy settling tank is connected to the intermediate settling tank and the liquid storage tank.