LP70 Multi station Precision Grinding and Polishing System

The LP70 precision grinding and polishing system will become a new member of Logitech's increasingly highly automated material processing technology. This desktop system adopts a modular design and can accommodate up to 4 workstations for simultaneous processing of multiple wafer samples. This system has high precision and is an ideal solution for production and research laboratories. By combining innovative design with intuitive operator control, enhanced process performance has been achieved.

The main functions include:

1. Four standard workstations, each with a wafer processing capacity of up to 4 "/100mm - the fixture speed of each workstation can be individually controlled to achieve high-precision results.

2. Bluetooth function, including real-time data acquisition and feedback, automatic flatness control, and digital display for endpoint thickness control on PP fixtures - improves process accuracy.

3. All process conditions are controlled through the user interface, including disk speed and material removal rate - providing operators with * control.

4. By using a peristaltic pump to measure abrasive feed, the amount of abrasive delivered to the disc can be highly controlled, allowing operators to easily repeat each process.

5. Build, save, and recall multi-stage recipes to improve the repeatability of the process.

6. Disk speed up to 100rpm - helps improve grinding and polishing speed.