Plasma cleaning machine, wafer activation and debonding equipment

Plasma cleaning machine is applied for surface pretreatment before wafer level packaging, surface activation before wafer level bonding, surface activation before photoresist coating, removal of small particles on the wafer surface, removal of surface organic residues, etc

Plasma cleaner and surface treatment machine activation equipment can increase surface tension, perform fine cleaning, remove static electricity, activate surfaces, and remove wafer bonding photoresist

Wafer plasma cleaning machine, silicon wafer plasma surface treatment equipmentThe wafer plasma surface cleaner first uses photolithography to expose the photoresist, and then uses another method of etching to remove the parts that need to be removed.

The plasma cleaning machine performs ultra cleaning and modification on the surfaces of metals, ceramics, glass, silicon wafers, plastics, and other objects with various geometric shapes and surface roughness, effectively removing organic contaminants from the sample surface.

Plasma cleaning machine, wafer activation and debonding equipmentRealize cleaning, activation, de gluing, and etching effects.

Plasma cleaning machine, wafer activation and debonding equipmentThe high-density 2.45GHZ microwave plasma processing equipment is used for cleaning and debonding crystal circles in integrated circuit and semiconductor production, removing pollutants and oxides from silicon wafers, and improving adhesion rate. The microwave plasma cleaning and debonding machine can handle small spaces such as micropores and slits, with high activity and efficiency, and will not cause ion damage to electronic devices. Through process validation, the microwave plasma cleaning machine has reduced the contact angle and improved the wire bonding strength.

The application of plasma cleaning machine wafer activation and debonding equipment includes pretreatment, ashing/photoresist/polymer stripping, chip collision, electrostatic elimination, dielectric etching, organic pollution removal, chip decompression, etc. Using a plasma cleaning machine can not only remove photoresist and other organic substances, but also activate and thicken the chip surface, improve the wettability of the chip surface, and make the chip surface more adhesive.

Application of Microwave Plasma Cleaning Machine in Semiconductor Packaging Process:

1. Prevent packaging layering

2Improve the quality of solder wires

3. Increase bonding strength

4. Improve reliability, especially advanced packaging with multiple interfaces

Why choose our plasma cleaning machine?

Focusing on research and development, manufacturing, and production of various specifications of plasma cleaning machines for more than 20 years, our cooperative enterprises cover many industries such as semiconductors, electronics, optoelectronics, textiles, plastics, automobiles, plastics, biology, medical, printing, home appliances, daily necessities, and environmental protection, serving over 300 customers

Free consultation and explanation, free sample testing and processing, free on-site training, installation and debugging

We can provide customized equipment solutions according to different customer needs. Welcome to visit our factory for inspection