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OPTM series microspectroscopy film thickness analyzer

NegotiableUpdate on 02/03
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Overview
The OPTM series microspectroscopy film thickness analyzer uses microspectroscopy to measure absolute reflectance in small areas, enabling high-precision analysis of film thickness/optical constants. $r $n $r $n can measure the thickness of coatings through non-destructive and non-contact methods, such as various films, chips, optical materials, and multilayer films. In terms of measurement time, it can achieve high-speed measurement of 1 second per point, and is equipped with software that can easily analyze optical constants even for first-time users.
Product Details

Product Features


Non contact and non-destructive, the measuring head can be freely integrated into the customer's system

Beginners can easily analyze the beginner analysis mode of modeling

High precision and high reproducibility measurement of absolute reflectance in the ultraviolet to near-infrared wavelength range, capable of analyzing multi-layer film thickness and optical constants (n: refractive index, k: extinction coefficient)

Single point focusing and measurement can be completed within 1 second

A wide range optical system (UV~NIR) under microscopic spectroscopy

● Independent testing head corresponds to various inline customization requirements

The minimum corresponding spot is about 3 μ m

● Can analyze nk for ultra-thin films

Measurement project

● Absolute reflectance analysis

Multi layer film analysis (50 layers)

Optical constants (n: refractive index, k: extinction coefficient)

Transparent substrate samples such as films or glass cannot be measured correctly due to the influence of internal reflection of the substrate. The OPTM series uses an objective lens that can physically remove internal reflections, allowing for high-precision measurements even on transparent substrates. In addition, for films or SiC samples with optical anisotropy, they can also be measured separately without being affected by them.

(Zhuanli No. 5172203)
OPTM 系列显微分光膜厚仪

Scope of application

Semiconductor, composite semiconductor: silicon semiconductor, silicon carbide semiconductor, gallium arsenide semiconductor, photoresist, dielectric constant material

FPD: LCD, TFT, OLED (organic EL)

Data storage: DVD, magnetic head film, magnetic materials

Optical materials: filters, anti reflective films

Flat panel displays: LCD displays, thin-film transistors OLED

● Thin films: AR film, HC film, PET film, etc

Other: building materials, adhesives, DLC, etc

Specification and style

(Automatic XY platform type)


OPTM-A1 OPTM-A2 OPTM-A3
wavelength range 230 ~ 800 nm 360 ~ 1100 nm 900 ~ 1600 nm
Film thickness range 1nm ~ 35μm 7nm ~ 49μm 16nm ~ 92μm
measurement time Within 1 second/1 hour
Optical path size 10 μ m (minimum about 3 μ m)
Photosensitive element CCD InGaAs
Light source specifications Deuterium lamp+halogen lamp halogen lamp
size 556 (W) X 566 (D) X 618 (H) mm (main body of automatic XY platform type)
weight 66kg (main body of automatic XY platform type)

OPTM selection

OPTM 系列显微分光膜厚仪Automatic XY platform type

OPTM 系列显微分光膜厚仪Fixed frame type

OPTM 系列显微分光膜厚仪Embedded head shape

Wavelength and film thickness range

OPTM 系列显微分光膜厚仪

Selection Table

wavelength range Automatic XY platform type Fixed frame type Embedded head shape
230 ~ 800nm OPTM-A1 OPTM-F1 OPTM-H1
360 ~ 1,100nm OPTM-A2 OPTM-F2 OPTM-H2
900 ~ 1,600nm OPTM-A3 OPTM-F3 OPTM-H3

objective lens

type magnification Measure the light spot field of view
Reflection on object type 10x lens Φ 20μm Φ 800μm
20x lens Φ 10μm Φ 400μm
40x lens Φ 5μm Φ 200μm
Visual Refractive Type 5x lens Φ 40μm Φ 1,600μm

Measurement case

Semiconductor Industry - SiO2 and SiN Film Thickness Measurement Cases

OPTM 系列显微分光膜厚仪

In semiconductor processes, SiO2 is used as an insulating film, while SiN is used as an insulating film with a higher dielectric constant than SiO2, or as a blocking protection during CMP removal of SiO2, after which SiN is also removed. When the performance of insulating films is used in this way, it is necessary to measure the thickness of these films for precise process control.

FPD Industry - Color photoresist film thickness measurement

OPTM 系列显微分光膜厚仪

OPTM 系列显微分光膜厚仪

In the process of producing color filter films, a color photoresist is generally coated on the entire glass surface and exposed and developed through photolithography to leave the desired pattern. The RGB colors complete this process in sequence.

The uneven thickness of color photoresist is the reason for the deformation of RGB patterns and color deviation of color filters, so the management of film thickness for color photoresist is very important.

FPD Industry - Analyzing ITO Structure with Tilt Mode

ITO film is a transparent electrode material used in liquid crystal panels and other applications. After film formation, it needs to undergo annealing treatment (heat treatment) to enhance conductivity and transparency. At this point, the oxygen state and crystallinity undergo changes, resulting in periodic tilting of the film thickness. In optics, it cannot be regarded as a uniform single-layer film.

Measure the tilt degree of ITO using a tilt mode based on the nk values of the upper and lower interfaces.

Semiconductor industry - using interface coefficient to determine film thickness on rough substrates

If the substrate surface is non mirror and has a high roughness, the measured light will decrease due to scattering, and the measured reflectivity will be lower than the actual value.

By using interface coefficients, the thickness of the thin film on the substrate can be measured, taking into account the decrease in reflectivity on the substrate surface.

DLC Coating Industry - Measurement of DLC Coating Thickness for Various Applications

OPTM 系列显微分光膜厚仪

DLC (diamond-like carbon) coatings are widely used for various purposes due to their high hardness, low friction coefficient, wear resistance, electrical insulation, high barrier properties, surface modification, and affinity with other materials.

By using a microscopic optical system, shaped samples can be measured. In addition, the monitor can be used to analyze the cause of abnormalities by confirming the measurement position while conducting measurements.