- Phone
-
Address
104, Building B310, Diaxigu Mountain Villa, No. 1008 Xuefeng Road, Xuefu Street, Yuelu District, Changsha City, Hunan Province
Hunan Zhongqi Technology Co., Ltd
104, Building B310, Diaxigu Mountain Villa, No. 1008 Xuefeng Road, Xuefu Street, Yuelu District, Changsha City, Hunan Province
Nakazaki is available for sale! Japanese JFM Ceramic Leadless Chip Carrier
Nakazaki is available for sale! Japanese JFM Ceramic Leadless Chip Carrier
C04D2-01 is a ceramic leadless chip carrier (CLCC) produced by JFM Corporation in Japan. It belongs to surface mount ceramic packaging and is suitable for high-frequency, high-density applications such as VLSI, ASIC, and ECL circuits.
projectSpecification indicators
Product ModelC04D2-01
boxed typeCeramic Leadless Chip Carrier (CLCC)
Ceramic body size4.40 × 7.00 mm
Sealing area size6.50 × 4.20 mm
Chip mounting area size2.50 × 3.00 mm
total thickness2.40 mm
Packaging characteristics
Leadless design: adopting a leadless structure, suitable for high-density surface mount, with advantages such as low parasitic effects, small and lightweight, good heat dissipation, and high reliability.
Compact size: The body size is only 4.40 × 7.00 mm, suitable for applications with limited space.
Optional electrode configuration: Supports two or four side configuration of solder pads, with optional pin spacing of 1.27 mm or 1.00 mm.
Material and Performance Characteristics
Ceramic body: with high hardness, excellent insulation, low electrical resistivity, and good corrosion resistance
Sealed area: 6.50 × 4.20 mm, designed for cover plate sealing, forming an airtight chamber to protect the internal chip
Chip mounting area: 2.50 × 3.00 mm, used for installing integrated circuit chips
Typical Applications
C04D2-01 is suitable for the following scenarios:
VLSI (Very Large Scale Integrated Circuit) packaging
ASIC (Application Specific Integrated Circuit) packaging
ECL (emitter coupled logic) circuit packaging
Other electronic modules with strict requirements for high-frequency performance and heat dissipation
Model Description
C04 "indicates that the package belongs to the CLCC series, with a total of 18 electrodes/pads (calculated according to JFM naming rules). It adopts a leadless structure design and is suitable for automated surface mount production.

Nakazaki has currently obtained NPM pulse, FANUC Fanuc, Japan SR, Japan SAKAE Sibo, Japan Endo, NITTO KOHKI Nitto Kogyo, SUZUKI ultrasonic cutting machine, GRAPHTEC imaging technology, JST Japanese pressure, AND Ainde, TRUSCO Zhongshan, ASONE Asuwang, TOA-DKK East Asia Radio, ATAGO Aituo, HOZAN Baoshan, FUNATECH Funakong, VESSEL Weiwei, HEIDON Shinto Science, HIOS Good Grip Speed, SIBATA Shibata Science, HORIBA Horiba, ONOSOKKI Ono, KETT Kate, Japan CKD, Japan Miaode CONVUM, HAKKO White Light, SSD Sisiti, MALCOM, MUSASHI Musashi, AMADA Miyagi, MECT Maite, Mitutoyo Sanfeng, PISCO and other brand certifications.