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    104, Building B310, Diaxigu Mountain Villa, No. 1008 Xuefeng Road, Xuefu Street, Yuelu District, Changsha City, Hunan Province

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Nakazaki is available for sale! Japanese JFM Ceramic Leadless Chip Carrier

NegotiableUpdate on 05/07
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Overview

Nakazaki is available for sale! JFM Ceramic Leadless Chip Carrier $r $nC04D2-01 is a ceramic leadless chip carrier (CLCC) produced by JFM Corporation in Japan. It belongs to surface mount ceramic packaging and is suitable for high-frequency and high-density applications such as VLSI, ASIC, and ECL circuits.

Product Details

Nakazaki is available for sale! Japanese JFM Ceramic Leadless Chip Carrier

Nakazaki is available for sale! Japanese JFM Ceramic Leadless Chip Carrier

C04D2-01 is a ceramic leadless chip carrier (CLCC) produced by JFM Corporation in Japan. It belongs to surface mount ceramic packaging and is suitable for high-frequency, high-density applications such as VLSI, ASIC, and ECL circuits.

projectSpecification indicators

Product ModelC04D2-01

boxed typeCeramic Leadless Chip Carrier (CLCC)

Ceramic body size4.40 × 7.00 mm

Sealing area size6.50 × 4.20 mm

Chip mounting area size2.50 × 3.00 mm

total thickness2.40 mm

Packaging characteristics

Leadless design: adopting a leadless structure, suitable for high-density surface mount, with advantages such as low parasitic effects, small and lightweight, good heat dissipation, and high reliability.

Compact size: The body size is only 4.40 × 7.00 mm, suitable for applications with limited space.

Optional electrode configuration: Supports two or four side configuration of solder pads, with optional pin spacing of 1.27 mm or 1.00 mm.

Material and Performance Characteristics

Ceramic body: with high hardness, excellent insulation, low electrical resistivity, and good corrosion resistance

Sealed area: 6.50 × 4.20 mm, designed for cover plate sealing, forming an airtight chamber to protect the internal chip

Chip mounting area: 2.50 × 3.00 mm, used for installing integrated circuit chips

Typical Applications

C04D2-01 is suitable for the following scenarios:

VLSI (Very Large Scale Integrated Circuit) packaging

ASIC (Application Specific Integrated Circuit) packaging

ECL (emitter coupled logic) circuit packaging

Other electronic modules with strict requirements for high-frequency performance and heat dissipation

Model Description

C04 "indicates that the package belongs to the CLCC series, with a total of 18 electrodes/pads (calculated according to JFM naming rules). It adopts a leadless structure design and is suitable for automated surface mount production.

中崎有售!日本JFM陶瓷无引线片式载体

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