Multi functional universal wafer handling machine system

-Device features-

Using specialized software, automatic handling is carried out on a box by box basis.

On the handling side, the measurement wafer can be selected, and manual handling is also supported.

Realize waste free grasping through a workpiece detection system.

By using a highly repetitive drive system, high reliability handling can be achieved.

It can be transported to various workstations on the device side.

main lineup

Desktop style

▲ 150mm desktop automatic loading platform combination

▲ 200mm desktop automatic loading platform combination

Suitable for 75mm/100mm/150mm/200mm/300mm size wafers

● Vertical

Suitable for 150mm/200mm/300mm size wafers

Specifications

Suitable for automatic handling of silicon wafer microscopy inspection.

Combined with an automatic workbench, it can achieve fully automatic handling (requiring communication with the inspection device).

● Manual conveying mode: 750 (w) x600 (D) X1480 (H) (6-inch self-supporting type, including main power supply) ※ We will also explore products other than wafers.

We will provide you with an integrated system solution for measurement, inspection, and analysis.

Respond according to demand

The most suitable solution can be provided based on the wafer size and inspection content.

Capable of meeting various needs such as bonding silicon wafers (thickness) and handling fragile wafers. Because all moving axes are controlled by motors, speed control and coordinate management of wafer retrieval speed, position coordinates, insertion speed, position coordinate points, support side transportation, and removal can achieve safer transportation. In addition, through the above program, multiple wafers of different thicknesses can be registered, so that one device can handle multiple wafers.

Using resin based polyetheretherketone (PEEK) material

The damage rate of the handling arm in the event of a malfunction

And the damage rate of wafers has also decreased.

● Can be linked with existing inspection devices.

Can be added to the inspection device you are already using

Transportation system. Regardless of the microscope brand, we will explore it

Can it be adapted.

● Can be linked with automatic inspection devices. But it will incur communication costs with the inspection device side.

*Need to negotiate with the manufacturer of the inspection device. ▲ Setting values for each moving axis

Excellent operability

Adopting an 8-inch programmable logic controller (PLC) screen, various setting operations such as full inspection and sampling inspection can be easily performed at a glance. According to your needs, the layout of the inspection screen can also be changed. In conjunction with the automatic inspection device, a warning light (three color light) is used to notify the operator when the inspection of the 25 piece material box is completed.

▲ Setting values for each moving axis

Rich options

Various optional configurations are available, including back micro inspection, surface macro inspection mode, cleanliness improvement, and anti-static measures. Even after importing the handling device, optional configurations with basic specifications can be added.

Equipped with automatic recognition function for multiple material boxes, it can automatically recognize and register coordinate values for products of different thicknesses through positioning (rod), achieving high reliability and safe handling.

A highly clean environment can be maintained through a fully enclosed design.

● Through 2 boxes (loading/unloading), 3 boxes (loading and unloading)

OK · NG) can classify products.

▲ Observation arm inside the bag

Combination example: YIT200A-L-P-2N

Linked with a 200mm automatic worktable, equipped with back detection function, warning light, corresponding to 2 material boxes, and of notch detection type.

Regardless of the microscope brand, it can be linked with a conveyor device. If the microscope side is an automatic table type, it can also automatically transport 25 sheets.

However, due to the need to communicate with the inspection device, consultation with the device software manager is required.

Basic specifications of wafer handling equipment

■ Options

·Mapping (detecting the presence/absence of products)

·Wafer pop-up detection

·Error code display

·QR code

·Electrostatic protection measures (ion generator)

·Cleanliness improvement measures (high-efficiency air filter/ultra high efficiency air filter)

·Adapt to sample size and shape

·Support multiple material boxes