Microfocus X-ray

Microfocus X-ray

To meet the requirements of defect detection for large-sized electronic modules and product quality control in the electronics industry, we aim to solve the key scientific problem of three-dimensional layered imaging and achieve high-precision automatic non-destructive testing of welding quality for electronic module packaging, printed circuit boards, high-density packaging, etc. This will be applied to product identification and evaluation, destructive physical analysis (DPA), and product process quality identification of various electronic systems in aerospace, aviation, marine, land, and strategic equipment. In the development and production process of equipment, we will identify defects caused by product design, process design, and material introduction, such as PCB hole breakage, pillow effect of solder joints, cracks, etc BGA device solder ball defects and structural damage can improve the quality and reliability level of electronic products, enhance product research and development design and manufacturing process level, and strengthen the ability to identify and analyze electronic product defects.

Adopting the advanced Computed Laminography (CL) scanning mode and algorithm, it has the ability to obtain clear tomographic images through high-speed scanning.

Microfocus X-ray

EFPscan plane CT (also known as plane CT) is a CT detection system for PCB boards and electronic devices, with 2D/2.5D/3D X-ray functions, which can perform offline detection and online full inspection. Adopting the advanced Computed Laminography (CL) scanning mode and algorithm, it has the ability to obtain clear tomographic images through high-speed scanning.

Fast scanning speed

Equipped with programmable automatic recognition and judgment function

Can be coordinated with the production line to achieve online detection

PCB board BGA、CSP、QFP、QFN

Power device IGBT

Open welding, no infiltration, porosity, offset