Micro nano processing services

The company has provided OEM and research services for multiple units at home and abroad in the fields of microneedles, AR helical/blazed gratings, metamaterial lenses (monocrystalline silicon, amorphous silicon, silicon nitride), silicon optical mechanisms, deep silicon/bulk silicon structures, and other devices and mechanisms.

Process capabilities: electron beam exposure, nanoimprinting, laser direct writing (maskless lithography), vacuum coating, sputtering coating, PECVD，LPCVD，ICP-RIE， Deep silicon etching, metal etching, dielectric etching, ion beam etching, reactive ion beam etching, wafer bonding, scribing, and so on.

Commonly used devices/structures: microneedles, AR helical grating, metamaterial lenses (monocrystalline silicon, amorphous silicon, silicon nitride), silicon optical structures, deep/bulk silicon structures, etc.

Process capabilities: electron beam exposure, nanoimprinting, laser direct writing (maskless lithography), vacuum coating, sputtering Coating, PECVD, LPCVD, ICP-RIE, deep silicon etching, metal etching, dielectric etching, ion beam etching,Reactive ion beam etching, wafer bonding, scribing, and more.

Commonly used devices/structures: microneedles, AR oblique tooth blazed gratings, superlenses (monocrystalline silicon, amorphous silicon, silicon nitride),Silicon optical structure, deep silicon/bulk silicon structure, etc.