Leica EM TIC 3X - Innovative features in design and operationHigh throughput, increasing cost-effectiveness
›› High quality cutting sections can be obtained, with area sizes up to>4 × 1mm
›› Diversified platform design can accommodate three samples in one operation
›› High ion grinding rate, Si material 300 μ m/h, 50 μ m cutting height, can meet laboratory high-throughput requirements
›› Can accommodate a maximum sample size of 50 × 50 × 10mm
›› There are various sample stages that can be used, which are simple, easy to use, and high-precision
›› It can easily and accurately complete the calibration work of installing the sample on the stage and adjusting the relative position with the baffle
›› Simple control through touch screen, no special operation skills required
›› The sample processing process can be monitored in real-time and can be observed through a stereo mirror or HD-TV camera
›› LED lighting for easy observation of samples and position calibration
›› Built in, decoupled design vacuum pump system, providing a vibration free observation field
›› Contrast enhancement can be further performed on the prepared flat cutting section through ion beam etching treatment.
›› Parameters and programs can be uploaded or downloaded via USB
›› Suitable for almost any material sample
›› Using a frozen sample stage, the baffle and sample temperature can be lowered to -150 ° C