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Hefei Chenyue Automation Engineering Co., Ltd

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    2nd Floor, Building 38, Zhongnan High tech Industrial Park, Shuangdun Road, Shuangfeng Economic Development Zone, Hefei City, Anhui Province

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LS wafer cleaning APM-HE30AN0H hollow axis servo motor

NegotiableUpdate on 05/13
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Overview

LS wafer cleaning APM-HE30AN0H hollow shaft servo motor 1, Spinner Motor hollow shaft motor features $r $n1, hollow shaft high-speed motor structure: rated speed: 5000rpm, maximum speed 6000-8000rpm $r $n2, ultra fast acceleration/deceleration time; $r$n3、 Low noise, low vibration, and low shaft end runout coefficient; $r$n4、 The shaft hole adopts a vacuum hollow shaft design, and the design of the shaft end ensures smooth operation of the chunk. The motor power is 750W, and the APM-HE30ACH wafer etching and solidification equipment uses a large hollow motor for wafer cleaning

Product Details

LS wafer cleaning APM-HE30AN0H hollow axis servo motor

Semiconductor wafer handling robot

Semiconductor wafer polishing platform

Pharmaceutical packaging industry

machine tool

Medical equipment - CT machine

PCB drilling and inspection

SMT placement machine

Coordinate measuring instrument

Precision rotary table and indexing table

Flat panel display processing and assembly line

Printing machinery

Automotive parts processing

Film production

Solar energy and battery production line

Special Equipment

Semiconductor coating and development

Semiconductor cleaning and etching

Semiconductor washing tower

LS wafer cleaning APM-HE30AN0H hollow axis servo motor

1、 Characteristics of Spinner Motor Hollow Shaft Motor

1. Hollow shaft high-speed motor structure: rated speed: 5000rpm, maximum speed 6000-8000rpm

2. Ultra fast acceleration/deceleration time;

3. Low noise, low vibration, and low shaft end runout coefficient;

4. The shaft hole adopts a vacuum hollow shaft design, and the design of the shaft end ensures smooth operation of the chunk

LS晶圆清洗APM-HE30AN0H中空轴伺服电机

LS wafer cleaning APM-HE30AN0H hollow axis servo motor

Korean LS Spinner motors and hollow shaft servo motors are used in semiconductor wafer electroplating, coating, debonding, developing, cleaning, solidification, etching, wafer bonding, packaging and testing equipment. Some models are as follows:

1. Hollow axis servo motor


LS晶圆清洗APM-HE30AN0H中空轴伺服电机100W APM-HB01AAH incremental encoder

200W APM-HB02AAH incremental encoder

400W APM-HB04AAHIncremental encoder

900W APM-HE09ACHIncremental encoder

900W APM-HE09ACH-TAIncremental encoder

1.5KW APM-HE15ACHIncremental encoder

APM-HE15AN0H-ZC01 Single Loop 20 Bit Encoder

3KW APM-HE30ACHIncremental encoder

APM-HE30AN0H-ZC01 Single Loop 20 Bit Encoder


2. Spinner motorLS晶圆清洗APM-HE30AN0H中空轴伺服电机

250W APM-HB03HBH-CD

Application of 4-inch 6-inch adhesive development and cleaning equipment.

250WAPM-HB03HBH-CD1

Application of 4-inch 6-inch adhesive development and cleaning equipment.

250WAPM-HB03HBH-GY

Application of 4-inch 6-inch adhesive development and cleaning equipment.

250WAPM-HB03HBH-SH01

Application of 4-inch 6-inch adhesive development and cleaning equipment.

600W APM-HC06HBH

6Application of 8-inch adhesive development and cleaning equipment.

650W APM-HC06ACH-ZC03

8Application of 12 inch adhesive development and cleaning equipment.

750WAPM-HC07ACH-WN01

8Application of 12 inch adhesive development and cleaning equipment.

750WAPM-HC07HCH-1008Application of 12 inch adhesive development and cleaning equipment.

1.1KW APM-HE11DCH anti-corrosion,8Application of 12 inch adhesive development and cleaning equipment.

LS wafer cleaning APM-HE30AN0H hollow axis servo motor