LAUDA Semistat Semiconductor Temperature Control System

LAUDA Semistat Semiconductor Temperature Control System，By using an electrostatic chuck (ESC),E-chuck）Dynamic temperature control,Provide stable temperature control for plasma etching applications.STOP stoppedBased on the Peltier element heat transfer theory design, it can save up to 90% of energy consumption compared to traditional compressor systems. Small in size and occupying less space, it can be installed in the interlayer under the floor to save clean room space.LAUDA Semistat canQuickly and accurately control the process temperature within ± 0.1 K to improve inter wafer homogeneity.

Product Features:

• Low energy consumption system without compressor and refrigerant,Quiet operation with minimal vibration

• Equipped with a clean dry air (CDA) blowing interface to prevent condensation from occurring

• Compact structure, light weight, small footprint, very suitable for installation under the floor
• The amount of thermal conductive liquid used is extremely small

• No need for filters or DI components

• Water cooled type

Typical applications:

In semiconductor production, plasma etching is the core part of the process chain, which can be divided into dry etching and wet etching. In dry etching, semiconductor boards (chips) are subjected to plasma treatment in a vacuum etching chamber. Ions in the plasma bombard the chip, causing the material to detach. For example, the oxide layer on a silicon chip can be removed using this method and then coated with a doping layer (which adds foreign atoms and thus has a certain conductivity).

The temperature of the plasma will affect the speed and efficiency of etching. If the temperature is too low, the plasma is not active enough to effectively ablate the material. If the temperature is too high, the material may be excessively eroded, resulting in errors and damage. Therefore, precise control of plasma temperature is crucial in semiconductor production, as the processing range of chips is between micrometers and nanometers. Even a slight change in temperature can cause significant changes in the size and shape of the etched structure.LAUDASemistat canFor dry etchingThis sensitive processProvide specialized temperature control solutions.

Product Parameters:

The working temperature range is -20 ℃ .. 90 °C

Temperature stability 0.1°C

Heater power minimum 6 kW

Minimum filling capacity 1.25 L

Maximum filling capacity 1.6 L

Dimensions (width x depth x height) 116 x 300 x 560 mm

Weight 25 kg

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Cooling power output

According to different process temperatures and cooling water flow rates

LAUDA Semistat Semiconductor Temperature Control System

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