Japanese IAS Silicon Wafer Metal Pollution Analysis System

Japanese IAS Silicon Wafer Metal Pollution Analysis System

Tool for analyzing metal contamination content in silicon wafers

Expert ™ It includes a series of VPD-ICPMSI online models, which are divided into laboratory type multifunctional Expert Lab, universal Expert PS, and cutting-edge process production line specific Expert FAB according to the degree of automation and unmanned operation. Different models can achieve fully automatic integrated operation with ICPMS of different brands.

Tool for analyzing metal contamination content in silicon wafers

With the increasing integration and complexity of semiconductor ICs, the 7nm process has been achieved, and the contribution of pollutant control to IC production yield is also increasing. 12pm wafers have gradually become the main choice for excellent processes, and their acceptable metal impurity concentration is also decreasing, currently approaching 1E7-1E8 atoms/cm2. The fully automated wafer surface vapor phase decomposition (VPD) technology is a management project for analyzing wafer metal impurities in excellent semiconductor IC processes. The total reflection X-ray fluorescence (TRXRF) method used in the past has gradually been replaced by ICPMS/MS technology. The various manual VPD operation steps used in the past have been gradually replaced by fully automated technology due to the high skill requirements of operators and the inevitable introduction of human pollution. The fully automated VPDICPMS online system, as a cutting-edge technology, has become the main choice for excellent IC processes. IAS Inc. in Japan is a professional supplier of semiconductor pollutant detection technologies, including VPD-ICPMS, CSI-ICPMS, and GED.

ICPMSI online technology is its core product line. Expert ™ It includes a series of VPD-ICPMSI online models, which are divided into laboratory type multifunctional Expert Lab, universal Expert PS, and cutting-edge process production line specific Expert FAB according to the degree of automation and unmanned operation. Different models can achieve fully automatic integrated operation with ICPMS of different brands.

Expert ™ The characteristics are as follows

The generation method of HF vapor

The method for generating HF vapor for VPD treatment of children is to use a PFA atomizer. The foaming method used in the past had the problem of the concentration of HF in the generated vapor changing over time, while the atomization method can keep Hydrofluoric acid constant

Concentration and fast etching speed.

The Load Port Expert TM wafer loader can accommodate 300mm (12 ") FOUP&FOSB, 200mm (8") SMIF, and provide 150mm (6 ") or 200mm (8") adapter racks.

Dual scan nozzle

SiC wafers belong to highly hydrophilic wafers and are commonly etched.

The surface of Si wafers may appear rough, and there may also be organic residue on the wafers after dry etching. The surfaces of various wafers are hydrophilic, and the scanning head may not be able to maintain the scanning solution during the scanning process, resulting in poor recovery of liquid residue on the wafer surface.

Expert ™ The standard configuration includes a special double set scanning tube, which creates negative pressure on the outer layer of the sleeve to keep the inner layer scanning liquid inside the sleeve, preventing liquid leakage from the sleeve; This design can scan hydrophilic wafers, which other designs cannot achieve.

Japanese IAS Silicon Wafer Metal Pollution Analysis SystemSafety certification

Expert TM complies with SEMl-S2 and S8 specifications and European standards (CE Mark). Standard equipment includes various interlocks, water and gas leak detectors, suitable for semiconductor factories with strict safety regulations.