Fully automatic ultrasonic silicon wafer cleaning machine

Product introduction: The fully automatic silicon wafer ultrasonic cleaning machine is mainly composed of a feeding platform, a cleaning part, a transfer robot arm, a rotating mechanism, an exhaust system, and an electronic control part. Product Description: 1 This device is a fully automatic processing equipment. two 10.4-inch large touch screen display/detection

The fully automatic silicon wafer ultrasonic cleaning machine is mainly composed of a feeding platform, a cleaning part, a transfer robot arm, a rotating mechanism, an exhaust system, and an electronic control part.

Product Description: How to Translate

This device is a fully automatic processing equipment.

2. 10.4-inch large touch screen display/detection/operation.

The cleaning process is controlled by Omron series PLC.

4. The cleaning operator places the cleaning basket filled with workpieces on the feeding platform. The cleaning basket is automatically sent to each workstation according to the set program for cleaning and rinsing the workpieces. The rinsed workpieces are transported to the unloading position by the chain and sent out by the chain. The cleaning basket is taken away by the operator after the field.

Cleaned items:

Silicon polycrystalline edge coating, top material, sheet material, crucible bottom material, and primary polycrystalline material, etc.