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Qianwan 1st Road, Qianhai Shenzhen Hong Kong Cooperation Zone, Shenzhen
Shenzhen Simi Technology Co., Ltd
Qianwan 1st Road, Qianhai Shenzhen Hong Kong Cooperation Zone, Shenzhen
Fracture toughness kic measurement system
TOP-Complex PRO The comprehensive fracture image analyzer is developed by our company based on the actual needs of our customers 《GB/T 21143-2014Unified test method for quasi-static fracture toughness《GB/T 4161-2007Plane strain fracture toughness of metallic materialsKICA precision instrument developed specifically for the precise measurement of fracture surfaces in impact specimens, based on the requirements specified in the "Test Methods".
This product is suitable for metal material fractureKicTheJicMeasurement and analysis of fracture toughness, crack length, line, angle, center of circle, rectangle, specimen size, etc. By using its specific electronic optical sampling system to perform real-time full field sampling of the fracture morphology of the impact specimen, it is possible to achieve equal measurement of fracture toughness fracture surface. Easy to operate, high accuracy, and capable of performing operations that were previously impossible to accomplish manually. The stored result data can be repeatedly checked and processed by users.
Fracture toughness kic measurement system
KicTheJicMeasurement of fracture toughness and crack length
Fracture area measurement
Automatic sample size measurement
Automatic measurement of sample sizes for various specifications (plates, bars)
Multiple macroscopic fracture measurements
Multiple area and percentage measurements
The use of a large depth of field dedicated telephoto lens ensures that there will be no focal length, blur, or changes in size or shape caused by stage differences. The distortion of the product image can be ignored. The algorithm of the measurement software * ensures high-precision measurement of the entire system and restores the true size of the product.
By using a small distortion lens, the distortion of the product image can be ignored, thereby achieving more accurate measurements within the field of view.
Adopting sub-pixel segmentation technology with * can ensure measurement accuracy to a greater extent.
Even the deformation at the edges within the field of view is relatively small
The use of a large depth of field specialized design with a telephoto lens allows for negligible distortion in product images, enabling more accurate measurements within the field of view.
Even if there is a gap, the focus is still clear
Adopting a specially designed center lens with a large depth of field to ensure that there is no blurring of focal length caused by stage differences. As long as the workpiece is within the depth of field, there is no need to focus, and the entire workpiece can be imaged clearly up and down.