Deep silicon etching machine

1.Product Overview:

The PSE V300 is mainly used for 12 inch deep silicon etching, while also incorporating Bosch/On Bosch processes to achieve coverage in multiple process areas. This machine adopts professional and advanced fast response hardware configuration and software process control for Bosch cycle technology, combined with advanced process technology, to achieve good process performance under ultra-high aspect ratio. It is equipped with a multi cavity platform to meet the needs of large-scale production.

2.equipmentapplication：

Wafer size

8/12Inch compatible

Applicable Materials

Silicon, silicon oxide, silicon nitride

Applicable process

2.5D&3D TSVEtching and deep trench isolation/Capacitor etchingMEMSetching

Applicable fields

Integrated circuits, advanced packaging, power semiconductors, image sensors, microelectromechanical systems

3.Featured advantages：

Etching methodBy combining fast gas and RF switching control systems, the sidewall morphology can be accurately controlled in high aspect ratio deep silicon etching, achieving no damage to the sidewall and line width, and better etching uniformity and selectivity 135.

Structural design: Each cavity is designed as a single chip, which has better uniformity of airflow field and true roundness process performance, ensuring better quality and stability of semiconductor device manufacturing process. And the machine can be configured simultaneously 6 A chamber with excellent production capacity and performance 15.

Wafer edge protection: By optimizing the wafer edge protection device on the machine platform, the product yield has been effectively improved, and its effect is better than the current industry product indicators .

Process application: Fully applied to major domestic enterprises 12 Inch mainstreamfabThe factory is not onlyTSVThe main machines of the mass production line have also been expanded to include power devicesCISIn other fields. For example, inTSVExcellent performance in craftsmanship; in2.5DIn the process, we can provide products that meet the requirementsBVR(Back through-hole exposed) andBFREtching process solutions for different process requirements (flat exposure on the back).

4. Equipment characteristics

compatibleBosch/Non-BoschProcess, achieving coverage in multiple process areas

Optimized intake system andESCSystem, improve uniformity

Quick intake system ensures high etching rate,Scallopsmall

Realize high aspect ratio morphology control