DS300 Mass Flow Controller

NegotiableUpdate on 04/22

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

The DS300 pressure type gas mass flow controller is a gas mass flow controller developed for the semiconductor industry, suitable for semiconductor equipment and used in processes such as etching and sputtering of semiconductor devices. The DS300 adopts flow sensor technology based on pressure principle and high-precision piezoelectric valve control technology, making the product have the characteristics of zero drift, high accuracy, fast response speed, and insensitivity to pressure. All surfaces of the product in contact with gas are made of stainless steel metal, and the metal surface condition meets the requirements of SEMI standards.

Product Details

advantage

High control accuracy, with an accuracy of ± 1.0% S.P. (≥ 10% F.S.).
Fast response speed, response time ≤ 0.5sec.
Adopting flow sensor technology based on pressure principle, the product has pressure insensitive characteristics and can adapt to large fluctuations in gas source pressure.
The DS300 adopts effective mechanical processing technology and surface treatment technology to solve the problem of deep and small holes that cannot or are difficult to electro polish (EP), achieving surface electrochemical polishing treatment of stainless steel small holes, deep blind holes, and cross holes with relatively small aperture (aperture<1mm) and relatively large aspect ratio (>10), fully meeting the requirements of SEMI standards.

Technical Parameter

DS300C
model	DS300C
Valve type	normally closed
Flow specification (N2)	(0～30,50,100,200,300,500) SCCM (0～1,2,3,5,10) SLM
accuracy	±1% S.P. (≥10% F.S.) ±1% F.S. (＜10% F.S.)
linear	±0.5% F.S.
repeatability	±0.2% F.S.
response time	≤ 0.5sec
inlet pressure	240-450KPa flow specification ≤ 5SLM 350-450KPa flow specification>5SLM
KPa	≤ 1.2KPa Flow specification ≤ 5SLM ≤ 13.3KPa Flow specification>5SLM
temperature coefficient	Zero point: ≤ ±0.02% F.S./℃； During adjustment: ≤ ±0.1% F.S./℃
pressure resistance	3 MPa
Leakage rate	1×10^-11Pa·m³/ sec He
Sealing material	metal seal
Maximum working pressure	0.45MPa
Ambient Temperature	（10～45）℃
Input signal	Number: RS485 or DeviceNet Simulation: (0～5)VDC
output signal	Number: RS485 or DeviceNet Simulation: (0～5)VDC
drift	＜ 0.6% F.S./year without zero point correction
power supply	± 8 to ± 16 VDC (bipolar) or+14 to+28 VDC (unipolar)
surface chemical composition	Cr/Fe ratio ≥ 2.0; CrO thickness ≥ 20 (angstroms)
Surface roughness	Ra 5μinch
Standard joint form	VCR1/4 male connector; 1.125 "C-type sealed joint; 1.125 "W-shaped sealed joint; Compression Fittingφ6
Form of power connector	D-type 9-pin male connector; D-type 15 pin male connector; DeviceNet connector
weight	1.2Kg

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