Chip level devices, chip X-ray irradiation equipment

Chip level devices, chip X-ray irradiation equipment

Purpose: This instrument is suitable for irradiation of different types of devices and serves as an experimental platform for parameter modeling of device radiation effects. It provides reinforcement recommendations during device design and wafer stage, and evaluates radiation resistance performance. To provide experimental conditions for irradiation and parameter improvement of chip level devices, and to form a common technical service platform for radiation effect test evaluation and parameter improvement modeling throughout the development process of anti radiation devices, providing experimental technical support for the development of component design reinforcement processes.

systemparameter

1. Maximum voltage of X-ray tube: 160kV

2. Wire harness angle: 40°

3. Maximum power of the system:6000W

4. X-ray tube focal size: 5.5 mm

5. Adjustable irradiation distance(SSD)：OEM， Based on the final design

6. Dose control: Equipped with a real-time dose monitoring device, the dose rate, cumulative dose, and irradiation time are displayed in real-time. The maximum range of dose rate detection is greater than600gy/min。

7. Cooler: Integrated closed-loop heat exchanger

8. Stage: electrically operated

9. controlPLC control

10. The instrument is equipped with door interlocking and warning lights to ensure safe use.

11. Coaxial groove type high-temperature adsorption chuck（OEM）

12. chuckXY displacement platform, Z-axis rapid lifting, with fine adjustment lifting, chuck can rotate ± 45 °

13. PSM1000 microscope, HDMI interface high-definition (2 million pixels) CCD (optional with others)

14. microscopeXY displacement platform 2 "* 2"

15. Shockproof table900mm * 800mm (final size subject to actual)

16. Three-axis interface probe holder

17. air compressor

18. Optional high and low temperature coaxial chuck, semi-automatic probe station, dry air system, etc.