Chemical mechanical polishing liquid production line

NP-CMPchemistryMechanical polishing liquid production linemainly used forCMP（Chemical mechanical polishing solution）（Including ultra precision machining chemical mechanical polishing solutions based on silicon oxide nanoparticles, cerium oxide nanoparticles, silicon carbide chemical mechanical polishing solutions, aluminum oxide systems, and silica sol systems）The dispersionCrushing, dispersion, grading, modification, etc. of various micro nano materials, new energy materials, inorganic flame retardants, etc.

chemistryThe mechanical polishing liquid (CMP polishing liquid) production line is a specialized equipment used for mixing, dispersing, grinding, and homogenizing various components of the polishing liquid (such as abrasives, chemical reagents, dispersants, etc.). The core is to ensure system stability, no agglomeration, and uniform composition.

Core equipment composition (according to preparation process)

1. Pre mixing equipment: High speed mixing tanks are commonly used to preliminarily mix chemical reagents (such as oxidants, pH adjusters) with solvents (usually deionized water) to form a uniform liquid phase system, preparing for subsequent abrasive addition.

2. Dispersion grinding equipment:

-High shear disperser: By generating strong shear force through high-speed rotating rotor and stator, it disperses the initial aggregates of abrasives (such as SiO ₂, Al ₂ O3), which is a key equipment to ensure the dispersibility of polishing solution.

-Sand mill/ball mill: For high hardness or easily agglomerated abrasives, the abrasive particle size is refined to the target range (usually nanometer level) through the collision and friction of grinding media (such as zirconia beads), and the uniformity is further improved.

3. Homogenization and filtration equipment:

-Ultrasonic disperser: assists in breaking down small aggregates, especially suitable for the final dispersion of nanoscale abrasives, and improves the stability of polishing solution.

-Precision filter: using micron or submicron filter cartridges to filter out large particles of impurities or undissolved aggregates in the system, avoiding scratching wafers and other workpieces during polishing.

4. Mixing and storage equipment:

-Static mixer: Achieve efficient mixing during material transportation to avoid uneven distribution of local components.

-Clean liquid storage tank: equipped with stirring, temperature control, and dust prevention functions, used to store the prepared polishing solution to prevent delamination or contamination.

Core technical requirements

-High cleanliness: The inner wall of the equipment should be smooth and corrosion-resistant (such as using 316L stainless steel or PTFE material) to avoid contamination of the polishing solution by metal ions or impurities.

-Precise temperature control: Some chemical components release heat when mixed, and the temperature needs to be controlled through a jacket water cooling or heating system to prevent component deterioration or abrasive agglomeration.

-Controllable parameters: The dispersion speed, grinding time, stirring rate, and other parameters need to be precisely adjustable to match the preparation requirements of different formulations of polishing solutions.

NP-CMPchemistryMechanical polishing solutionproduction lineproduction lineThe tested process route has achieved mass production

Intelligent control, real-time monitoring, complete data storage, intuitive display of graphs and tables

Adjustable speed, controllable temperature, adjustable ultrasonic intensity, and adjustable timing

Easy and concise operation, easy to clean