BONDMASTER 600 Adhesive Tester

NegotiableUpdate on 05/06

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

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Overview

The BondMaster600 multi-mode adhesive testing instrument is simple and intuitive to operate, with high-quality performance. The BondMaster600 performance testing instrument combines multi-mode adhesive testing software with ultra advanced digital electronic devices, providing users with very clear and stable high-quality signals

Product Details

BondMaster 600 Multi Mode Adhesive Tester

Simple and intuitive operation, high-quality performance

The BondMaster 600 performance testing instrument combines multi-mode adhesive testing software with ultra advanced digital electronic devices, providing users with very clear and stable high-quality signals. Whether it is detecting the adhesion of honeycomb structure composite materials, metal laminated materials, or laminated composite materials, users can use BondMaster 600 for very simple operations. This is not only due to the quick access keys and simplified interface equipped with the detector, but also the pre-set settings provided by the instrument for common applications facilitate the user's operation process. The user interface of BondMaster 600 has been improved, and its workflow has been simplified, allowing users of all levels to archive test results and create reports.

The BondMaster 600 handheld adhesive tester is equipped with a 5.7-inch VGA display screen. When converted to full screen mode, its enhanced resolution and brightness make the display on the screen brighter and clearer. No matter what display mode or detection method the user is currently using, simply clicking the full screen mode conversion button will activate the full screen mode. The BondMaster 600 adhesive tester is equipped with various standard testing methods, including one transmitter and one receiver RF, one transmitter and one receiver pulse, one transmitter and one receiver sweep frequency, resonance, and a significantly improved mechanical impedance analysis (MIA) method.

Compact and portable, lightweight, ergonomic requirements

The ergonomic design of BondMaster 600 enables users to easily detect difficult to reach detection areas. For testing conducted in very small spaces, using a wrist strap installed by the manufacturer not only provides users with great comfort during operation, but also allows them to control important functions at all times.

Verified on-site

The casing of the BondMaster 600 instrument is based on a field validated, sturdy and durable body design. Instruments with this body structure can operate normally under extremely harsh and demanding testing conditions. The battery of BondMaster 600 instrument can provide long-term power supply, and its shell has sealing and waterproof properties. The corners of the instrument are equipped with high anti friction protective sleeves, and the back panel is equipped with a dual function bracket/hanger. Therefore, it can be said that this instrument is a very valuable tool for completing challenging testing applications.

Key Features

Designed to meet IP66 requirements.
Long term battery operation time (up to 9 hours).
Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
5.7-inch bright color VGA display screen.
Full screen options in all display modes.
A pre-set intuitive interface with specialized applications.
By using the RUN key, you can instantly switch between display modes.
Newly added SCAN view function (sectional view).
Newly added Spectrum view with new frequency tracking function.
Gain adjustment function of shortcut access keys.
All settings configuration pages.
There are at most two real-time readings.
Storage capacity up to 500 files (programs and data).
Preview of onboard files.

There are two types of instruments available, which combine flexibility and compatibility

BondMaster 600 comes in two models, suitable for different needs in composite material bonding testing. The basic model includes all one send one receive modes, while the B600M model provides users with all adhesive testing methods. Upgrading from the basic model of the instrument to a multi-mode model can be done remotely.

Both BondMaster 600 models are compatible with existing Olympus BondMaster probes, including those utilizing PowerLink technology. We also offer optional adapter cables to make the instrument compatible with probes produced by other manufacturers.

application	Suggested way to use
General debonding of skin and honeycomb core in honeycomb composite materials	One send, one receive (RF or pulse)
Debonding of skin and honeycomb core in composite materials with conical or irregular geometric shapes	One send, one receive (sweep frequency)
Small area debonding of skin and honeycomb core in honeycomb structure composite materials	MIA (Mechanical Impedance Analysis)
Identify repair areas in honeycomb composite materials	MIA (Mechanical Impedance Analysis)
General detection of delamination in composite materials	resonance
Testing the adhesion of metal laminated materials	resonance

characteristic	B600 (Basic)	B600M (multi-mode)
Calibration of frozen signal	√	√
Real time reading	√	√
Application Selection	√	√
Support for PowerLink probes	√	√
One send one receive RF and pulse modes	√	√
One send, one receive, sweep frequency	√	√
Mechanical Impedance Analysis (MIA) Mode		√
resonant mode		√ (including cables)
Calibration menu (resonance and mechanical impedance analysis modes)		√

To obtain a complete list of technical specifications, please download the complete BondMaster 600 User Manual.

General Specifications	External dimensions (width x height x thickness)	236 mm × 167 mm × 70 mm
	weight	1.70 kg, including lithium-ion battery
	Standard or instruction	US military standards 810G, CE, WEEE, FCC (USA), IC (Canada), RoHS (China), RCM (Australia and New Zealand), and KCC (Korea)
	Power requirements	AC main power supply: 100 VAC~120 VAC, 200 VAC~240 VAC, 50 Hz~60 Hz
	Input and output	1 USB 2.0 peripheral device port, 1 standard VGA analog output port, 1 15 pin I/O port (male) with analog output, and 3 alarm outputs.
environmental conditions	Operating temperature	–10 °C ～ 50 °C
	Storage temperature	0 ° C to 50 ° C (with battery); -20 ° C to 70 ° C (without battery)
	IP rating	The design meets the requirements of IP66 standard.
battery	Battery Type	Single lithium-ion rechargeable battery or AA type alkaline battery (placed in a battery box that can hold 8 batteries).
	Battery power supply time	8 to 9 hours
display screen	Dimensions (width x height; diagonal)	117.4 mm × 88.7 mm； 146.3 mm
monitor	type	Full VGA (640 x 480 pixels) Color Transversal LCD (Liquid Crystal Display)
display	pattern	Normal or full screen, with 8 color screen settings. The RUN button can switch between various display modes on the screen.
	Grid and Display Tools	5 grid options, crosshair (X-Y view only)
Connectivity and Memory	PC software	BondMaster PC software, included in the basic BondMaster 600 package. Users can view saved files in BondMaster PC software and also print reports through the software.
	data storage	500 files with onboard preview function that can be selected by the user.
	language	English, Spanish, French, German, Italian, Japanese, Chinese, Russian, Portuguese, Polish, Dutch, Czech, Hungarian, Swedish, and Norwegian.
	application	The application selection menu helps users to quickly and conveniently configure in various modes.
	Real time reading	Up to two real-time readings that reflect the characteristics of the measurement signal can be selected (the list of available readings depends on the selected mode)
Supported probe types	probe type	One transmitter, one receiver probe, mechanical impedance analysis probe (only MIA-B600M), and resonant probe (only B600M). This instrument is not only compatible with BondMaster's PowerLink probes and non PowerLink probes, but also with products from other major probe and accessory suppliers.
Adhesive testing technical specifications (all BondMaster models)>Probe connectors		11 needles Fischer
Adhesive testing technical specifications (all BondMaster models)	Gain*	0 dB ～ 100 dB， The increment is 0.1 or 1 dB.
Adhesive testing technical specifications (all BondMaster models)>Rotation*		0 ° to 359.9 °, with increments of 0.1 ° or 1 °.
Adhesive testing technical specifications (all BondMaster models)>Scan view**		Variable between 0.520 s and 40 s
Adhesive testing technical specifications (all BondMaster models)>Low pass filter*		6 Hz ～ 300 Hz
Adhesive testing technical specifications (all BondMaster models)>Probe driver		User adjustable low, medium, and high settings
Adhesive testing technical specifications (all BondMaster models)>Afterglow retention*		0.1 seconds to 10 seconds
Adhesive testing technical specifications (all BondMaster models)>Display clear*		0.1 seconds to 60 seconds
Adhesive testing technical specifications (all BondMaster models)>Available alarm types*		Three alarms simultaneously. There are the following options: box alarm (rectangular), polarity alarm (circular), sector alarm (pie shaped), scan alarm (time-based), and spectrum alarm (frequency response).
Adhesive testing technical specifications (all BondMaster models)>reference points*		Record up to 25 user-defined points
One send one receive technical specifications (all B600 models)>Supported one send one receive modes		The mode that can be selected by the user. You can choose radio frequency (burst pulse), pulse (envelope), or sweep frequency (frequency sweep)
One send one receive technical specifications (all B600 models)>frequency range		1 kHz to 50 kHz (RF, pulse) or 1 kHz to 100 kHz (sweep)
One send one receive technical specifications (all B600 models)>gain		0 dB ～ 70 dB， The increment is 0.1 or 1 dB.
One send one receive technical specifications (all B600 models)>Gate		10 μs ～ 7920 μs， Adjustable, with a step size of 10 μ s. The new automatic gate mode can automatically detect wave amplitude.
One send one receive technical specifications (all B600 models)>Frequency tracking*		There are up to 2 user adjustable markers for monitoring 2 specific frequencies from the swept frequency image.
Technical specifications for Mechanical Impedance Analysis (MIA) (B600M only)>Calibration Guide		Calibration menu, based on simple measurements of "BAD PART" (non-conforming workpiece) and "GOOD PART" (qualified workpiece), to determine the frequency of application.
Technical specifications for Mechanical Impedance Analysis (MIA) (B600M only)>Frequency Range		2 kHz ～ 50 kHz
Technical specifications for resonance (only B600M)>Calibration guide		Calibration menu, determine frequency based on probe response.
Technical specifications for resonance (only B600M)>frequency range		1 kHz ～ 500 kHz

Standard set of components

The standard configuration of BondMaster 600 is as follows:

Model:Basic type and multi-mode type (M).

power cordUp to 11 types of power cords (for DC adapters) are available.

Keypad and instruction labels:English, international symbols (icons), Chinese or Japanese.

Printing manual for 'Easy Beginner's Manual'Up to 9 language versions are available.

Items included in all BondMaster 600 models†: BondMaster 600 instrument with manufacturer installed wrist strap, "Easy Start Guide", calibration certificate, hard shell transport box, DC adapter with power cord, lithium-ion battery, AA battery box, USB communication cable, MicroSD memory card and adapter, one send one receive and mechanical impedance analysis probe cable, as well as BondMaster PC software and CD containing product manual.

The standard kit may vary depending on your location. To learn more about the situation, please contact your local dealer.

Only included in BondMaster 600M model: resonant probe cable.