Alpha W260 semiconductor packaging push-pull testing machine

Alpha W260 semiconductor packaging push-pull testing machineSpecially designed for testing the welding strength and solder joint adhesion of semiconductor chip wire bonding, supporting chip thrust, gold ball thrust, gold wire tension and other tests. Modular design can automatically identify parameters.

Whether in the semiconductor industry or various high reliability microelectronics industries such as automotive, aerospace, and new energy, the Kezhun push-pull testing machine can demonstrate multifunctionality and accuracy, giving its users confidence in the quality of its products. Additionally, it is worth mentioning that it is equipped with a self-developed measurement and control system, ensuring high precision and data repeatability, and reliable results.

Alpha W260 semiconductor packaging push-pull testing machineIt is a high-precision dynamic testing instrument designed specifically for the microelectronics packaging industry, mainly used for welding strength testing after wire bonding, adhesion testing between solder joints and substrate surfaces, and failure analysis. This device, with its superior performance and intelligent design, is widely used in fields such as semiconductor packaging, LED manufacturing, MEMS devices, etc., ensuring product quality and reliability.

Core functions and features

1. High precision force measurement

• Adopting a high-speed force value acquisition system with a resolution of up to 0.001N, ensuring the accuracy and repeatability of test data.

• Support multiple testing modes, including chip thrust, gold ball thrust, gold wire tension, etc., to meet different process requirements.

2. Intelligent module automatic recognition

• The equipment is equipped with modular testing components, and users can replace the corresponding testing modules (such as shear force module, tension module, etc.) according to their needs.

• The system automatically recognizes module types and intelligently switches ranges, greatly improving testing efficiency.

3. User friendly design

• Equipped with a high-definition touch screen, the operation interface is simple and intuitive, and supports multi language switching.

• Built in data storage and analysis software, capable of generating test reports and supporting data export (Excel/PDF format).

4. Stable and reliable performance

• Adopting a high rigidity mechanical structure to ensure no vibration interference during the testing process.

• Equipped with overload protection function to prevent equipment damage caused by misoperation.

Typical application scenarios

• semiconductor packagingDetect the welding strength of the bonding wire and optimize the process parameters.

• LED chip testingEvaluate the reliability of solder joints and improve product yield.

• Research and Failure AnalysisAccurately measuring the mechanical properties of micro solder joints to assist in material research.

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Alpha-W260 automatic push-pull testing machineWith high precision, intelligence, and stability as its core advantages, it has become an ideal choice for quality control in the microelectronics industry. For detailed technical solutions or customized services, please feel free to contact our engineering team.