01,21,2026 72 views
Circuits are the foundation of electronic technology and an important part of modern technology. From consumer electronics to cutting-edge technologyinstrumentThe electronic circuit almost directly determines the performance of the product. Therefore, the development of related technologies is affecting the development of many industries such as communication, computer, and healthcare. Highly valued by the industry.
One important development direction of electronic circuits is flexible electronic technology.
The so-called flexible electronics, in simple terms, refers to the production of organic or inorganic electronic devices on flexible substrates, so that they have a certain degree of deformation ability to meet the bending, unfolding and other needs of electronic devices. It is currently one of the research hotspots in interdisciplinary fields. In fact, there is a certain contradiction between the design of flexible electronics and high-performance circuits, which is why the development of flexible electronics is not fast. Although high-performance flexible circuit boards and high-performance sensors have been produced in some fields, further enhancing their flexibility is not an easy task. Especially achieving high-performance circuits on irregular surfaces remains a challenge in the field of flexible electronics. At present, technologies that may achieve such results, such as high-precision 3D printing, also have problems of high cost, low efficiency, and low yield rate. Therefore, moving high-performance electronic devices from "flat" to "three-dimensional" has become an enduring topic.
Recently, new research findings from Tianjin University seem to provide a new solution to this problem.
It is reported that the Huang Xian and Guorui teams from the National Key Laboratory of Precision Testing Technology and Instruments at Tianjin University, in collaboration with the Wang Hongzhang team from the Shenzhen International Graduate School of Tsinghua University, have proposed a "heat shrink preparation strategy" based on liquid metal circuits and thermoplastic films, which is expected to achieve high-performance circuit manufacturing on irregular surfaces.
According to relevant reports, the research team attempted to use common thermoplastic films as substrates and developed semi liquid metal materials with high conductivity and good fluidity to produce flexible electronic circuits that can undergo thermal shrinkage deformation. The circuit drawn with semi liquid metal material can effectively avoid the problem of circuit breakage during material shrinkage. Combined with thermoplastic film, it can be treated with warm water or hot air at 70 degrees Celsius and the drawn circuit can be attached to a three-dimensional surface.
It is worth mentioning that through experimental verification, the entire bonding process only takes about 5 seconds and has excellent durability. Even after 5000 repeated bending or twisting, its conductivity remains stable. The team has successfully utilized this technology forrobotThe customized tactile sensor array for the arms and head gives the robot a sensitive "electronic skin", providing an efficient and low-cost tactile solution to accelerate the integration of intelligent robots into daily life.
In the future, this technology is expected to deepen in the fields of smart agriculture, smart healthcare, and contribute to modern projects such as smart city construction and intelligent sensor micro nano processing.
At present, the relevant achievements have been published in the journal Nature Electronics, and interested readers can search and learn on their own.
Reference source: Tianjin University News Network
