Semiconductor plasma sputtering coating instrumentAdopting a two-stage sputtering method, it is widely used for SEM sample preparation or metal coating testing. Using low-temperature plasma sputtering technology, there is no high temperature during the coating process, making it less prone to thermal damage. This small plasma sputtering instrument uses a PLC control system and all touch screen operations, making it easy to learn and use. This model of instrument is also equipped with a rotating sample stage, which can effectively improve the uniformity of coating. This small plasma sputtering instrument is equipped with a rotating heating sample stage, which can improve the uniformity of coating and the adhesion of thin films. It uses a PLC control system and is operated entirely on a touch screen, making it easy to learn and use.
Working Principle:
Plasma excitation:
Introduce inert gases such as argon (Ar) and ionize them under the action of an electric field to form high-density plasma.
Ion bombardment sputtering:
High energy ion beams (energy>1keV) bombard metal or compound targets, causing atoms in the target to escape and form a directed molecular beam.
Thin film deposition:
Sputtering atoms deposit a film on the surface of the substrate, and the thickness is monitored in real-time using a quartz crystal oscillator.
Periodic cleaning:
Vacuum chamber cleaning: After deposition, use a 5% hydrogen nitrogen mixture to remove residual plasma, and replace the inner wall aluminum foil every 10 cycles.
Target maintenance: Metal targets are polished every 50 hours, and oxide targets are regularly inspected for cracks.
Core system maintenance:
Vacuum system:
Molecular pump oil is replaced every 500 hours, and mechanical pump filters are cleaned quarterly.
Check the deformation of the sealing ring every month, and replace the O-ring every six months.
Electrical system:
The insulation layer of high-voltage cables is tested for withstand voltage (>10kV) every week.
The plasma power supply radiator is dusted every two weeks to prevent arc discharge.
Emergency handling of faults:
Unstable sputtering arc: Immediately cut off the power and apply insulation tape to isolate exposed metal parts.
The vacuum degree drops too quickly: Check the flange sealing ring and locate the leak point with helium leak detection.
Thin film uniformity exceeds the tolerance: calibrate the substrate frame's revolution/rotation speed.